Micron Technology_MT53D512M64D4NY-046 XT ES:E
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Micron Technology
MT53D512M64D4NY-046 XT ES:E

774-MT53D512M64D4NY-046 XT ES:E
IC DRAM 32GBIT 2.133GHZ FBGA

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Tech Specifications

Clock Frequency
2.133 GHz
Part Status Code
Obsolete
Tape & Reel Qty
1000
Component Density
32Gb
I/O Voltage
0.6 VOLTS
Number of Components
4
Memory Type
Volatile
Product Status
Obsolete
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MT53D512M64D4NY-046 XT ES:E Description

MT53D512M64D4NY-046 XT ES:E Description

The MT53D512M64D4NY-046 XT ES:E is a high-performance DRAM memory IC chip designed by Micron Technology Inc. This chip offers a memory size of 32 Gbit with a memory organization of 512M x 64, making it suitable for applications requiring substantial memory capacity. The chip operates at a clock frequency of 2.133 GHz, ensuring fast data access and processing speeds. It is packaged in a Box format, providing robust protection and ease of handling during manufacturing and integration processes. The memory type is volatile, meaning it requires a continuous power supply to retain data, with a supply voltage of 1.1V. This product is classified under ECCN EAR99 and HTSUS 8542.32.0036, indicating its compliance with international trade regulations. Despite its obsolescence, the MT53D512M64D4NY-046 XT ES:E remains a reliable choice for specific legacy systems and applications where its unique features are still highly valued.

MT53D512M64D4NY-046 XT ES:E Features

  • High Memory Capacity: With a memory size of 32 Gbit and an organization of 512M x 64, this DRAM chip provides substantial memory resources ideal for applications requiring large data storage and processing.
  • Fast Data Access: The clock frequency of 2.133 GHz ensures rapid data access and processing, making it suitable for high-speed computing environments.
  • Low Power Consumption: Operating at a supply voltage of 1.1V, the chip offers energy efficiency, which is crucial for power-sensitive applications.
  • Robust Packaging: The Box package format provides excellent mechanical protection, ensuring the chip remains intact during handling and integration.
  • Compliance: Classified under ECCN EAR99 and HTSUS 8542.32.0036, this product adheres to international trade regulations, facilitating global distribution and use.
  • Moisture Sensitivity Level (MSL): With an MSL rating of 1 (Unlimited), the chip is highly resistant to moisture, reducing the risk of damage during storage and manufacturing processes.

MT53D512M64D4NY-046 XT ES:E Applications

The MT53D512M64D4NY-046 XT ES:E is ideal for a variety of applications, particularly those requiring high-speed data processing and substantial memory capacity. Some specific use cases include:

  • High-Performance Computing: Suitable for servers and workstations that require fast data access and processing for complex computations.
  • Data Centers: Ideal for data storage and retrieval systems that need to handle large volumes of data efficiently.
  • Telecommunications: Can be used in network infrastructure equipment where high-speed data transmission and processing are critical.
  • Industrial Automation: Applicable in control systems and monitoring equipment that require reliable and fast memory solutions.
  • Legacy Systems: Despite its obsolescence, this chip remains a viable option for maintaining and upgrading legacy systems where its specific features are still required.

Conclusion of MT53D512M64D4NY-046 XT ES:E

The MT53D512M64D4NY-046 XT ES:E, manufactured by Micron Technology Inc., is a high-performance DRAM memory IC chip that offers significant memory capacity and fast data access speeds. Its unique features, such as high memory organization, low power consumption, and robust packaging, make it a reliable choice for various applications, including high-performance computing, data centers, telecommunications, and industrial automation. Although it is now obsolete, its continued use in legacy systems highlights its enduring value and reliability in the electronics industry.

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