Micron Technology_MT53E1G32D2FW-046 AAT:B

Micron Technology
MT53E1G32D2FW-046 AAT:B  
Memory ICs Products

Micron Technology
MT53E1G32D2FW-046 AAT:B
774-MT53E1G32D2FW-046 AAT:B
LPDDR4 32G 1GX32 FBGA DDP
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    MT53E1G32D2FW-046 AAT:B Description

    Micron Technology's MT53E1G32D2FW-046 AAT:B is a high-performance DDR4 memory module designed for use in a variety of computing applications. Here is a description of the model, its features, and potential applications:

    Description:

    The MT53E1G32D2FW-046 AAT:B is a DDR4 SDRAM (Synchronous Dynamic Random Access Memory) module manufactured by Micron Technology, a leading global provider of advanced semiconductor solutions. This module is designed to meet the demands of high-speed data transmission and high-density memory storage, making it suitable for a wide range of computing applications.

    Features:

    1. DDR4 Technology: Utilizes the latest DDR4 memory technology, which offers faster data transfer rates and improved power efficiency compared to previous generations of DDR memory.

    2. High Capacity: With a capacity of 1GB (Gigabyte), this module provides ample memory for applications that require significant data storage and quick access to that data.

    3. Fast Speed: The module operates at a speed of 2400 MHz, allowing for rapid data processing and improved system performance.

    4. Dual-Rank Architecture: The dual-rank design enables higher memory capacity and improved performance in systems that support this configuration.

    5. Error Correction: Features error correction code (ECC) capabilities, which help detect and correct common data corruption errors, making it suitable for applications where data integrity is critical.

    6. Form Factor: The module is designed with a standard DIMM (Dual In-line Memory Module) form factor, making it compatible with a wide range of motherboards and systems that support DDR4 memory.

    7. Reliability: Micron's manufacturing process ensures high reliability and durability, making the module a dependable choice for long-term use.

    8. Thermal Management: Designed with thermal sensors and heat spreaders to manage heat effectively, which is crucial for maintaining performance and longevity.

    Applications:

    1. Servers: The high capacity and speed make this module ideal for server applications where large amounts of data need to be processed quickly.

    2. Workstations: Used in workstations that require high-performance memory for tasks such as video editing, 3D rendering, and complex simulations.

    3. Gaming PCs: Offers the speed and capacity needed for modern gaming PCs to handle high-resolution graphics and fast-paced gameplay.

    4. Enterprise Systems: Suitable for enterprise systems that require reliable and high-density memory for data-intensive applications.

    5. Embedded Systems: Can be used in embedded systems where high-speed data processing and memory capacity are critical.

    6. High-Performance Computing (HPC): The module's performance characteristics make it a good fit for HPC applications that demand rapid data access and high memory bandwidth.

    7. Research and Development: Useful in R&D environments where memory speed and capacity are essential for running complex algorithms and simulations.

    8. Industrial Automation: Can be utilized in industrial control systems that require fast memory to manage real-time data processing and control tasks.

    It's important to note that the actual performance and suitability of the MT53E1G32D2FW-046 AAT:B module will depend on the specific system configuration and the requirements of the applications being run. Always ensure compatibility with your system before installation.

    Tech Specifications

    Clock Frequency
    PPAP
    Data Bus Width (bit)
    Operating Current (mA)
    Number of Internal Banks
    Memory Type
    Product Status
    Automotive
    Supplier Package
    DRAM Type
    Chip Density (bit)
    Number of Words per Bank
    Package / Case
    Technology
    Voltage - Supply
    REACH Status
    Maximum Operating Supply Voltage (V)
    Maximum Clock Rate (MHz)
    EU RoHS
    Moisture Sensitivity Level (MSL)
    Operating Temperature
    Number of I/O Lines (bit)
    Memory Interface
    ECCN
    Memory Organization
    Grade
    Supplier Temperature Grade
    Mounting Type
    Standard Package Name
    Pin Count
    Mounting
    Qualification
    Memory Size
    HTSUS
    Package
    Organization
    PCB changed
    HTS
    ECCN (US)
    Supplier Device Package
    Address Bus Width (bit)
    Minimum Operating Temperature (°C)
    Maximum Operating Temperature (°C)
    Access Time
    Process Technology
    Package Height
    Mfr
    Maximum Access Time (ns)
    Memory Format
    Interface Type
    RoHS Status
    Number of Bits/Word (bit)
    Package Length
    Series
    Write Cycle Time - Word, Page
    Part Status
    Package Width
    Minimum Operating Supply Voltage (V)
    Mounting Style
    Data Bus Width
    RoHS
    Supply Voltage - Min
    Minimum Operating Temperature
    Type
    Moisture Sensitive
    Maximum Clock Frequency
    Maximum Operating Temperature
    Supply Voltage - Max
    USHTS

    MT53E1G32D2FW-046 AAT:B Documents

    Download datasheets and manufacturer documentation for MT53E1G32D2FW-046 AAT:B

    Ersa MT53E1G16D1, MT53E1G32D2, MT53E2G32D4      

    Shopping Guide

    Payment Methods
    Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
    Shipping Rate
    Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
    Delivery Methods
    Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service