Micron Technology_MT53E2G64D8TN-046 WT:C
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Micron Technology
MT53E2G64D8TN-046 WT:C

774-MT53E2G64D8TN-046 WT:C
PDF Datasheet
LPDDR4 128G 2GX64 FBGA
6 Weeks

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Tech Specifications

Clock Frequency
2.133 GHz
Part Status Code
Production
Organization
2 G x 64
Tape & Reel Qty
2000
Component Density
128Gb
HTS
EA
I/O Voltage
1.1/0.6 VOLTS
Number of Components
8
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MT53E2G64D8TN-046 WT:C Description

MT53E2G64D8TN-046 WT:C Description

The MT53E2G64D8TN-046 WT:C is a high-performance LPDDR4 memory IC chip manufactured by Micron Technology Inc. This device is designed for applications requiring high-speed data transfer and efficient power consumption. With a memory size of 128Gbit, organized as 2G x 64, it offers a substantial storage capacity in a compact form factor. The memory operates at a clock frequency of 2.133 GHz, ensuring rapid data processing and low latency. The access time of 3.5 ns and write cycle time of 18 ns further enhance its performance capabilities.

This memory IC chip features a parallel memory interface, which is ideal for systems requiring high data throughput. The memory type is volatile, meaning it retains data only while power is supplied, making it suitable for applications where data is frequently updated. The device is packaged in a surface-mount FBGA (Fine Ball Grid Array) format, which is known for its reliability and space efficiency. The supply voltage range of 1.06V to 1.17V ensures compatibility with low-power systems, making it an excellent choice for mobile and embedded devices.

MT53E2G64D8TN-046 WT:C Features

  • High-Speed Performance: With a clock frequency of 2.133 GHz and an access time of 3.5 ns, the MT53E2G64D8TN-046 WT:C delivers rapid data processing capabilities, making it suitable for high-performance computing and data-intensive applications.
  • Large Memory Capacity: The 128Gbit memory size, organized as 2G x 64, provides ample storage for complex applications and large datasets.
  • Low Power Consumption: The supply voltage range of 1.06V to 1.17V ensures efficient power usage, making it ideal for battery-powered and energy-sensitive devices.
  • Reliable Packaging: The surface-mount FBGA package offers robust mechanical stability and thermal performance, ensuring reliable operation in various environmental conditions.
  • Compatibility: The parallel memory interface ensures compatibility with a wide range of systems and architectures, facilitating easy integration into existing designs.

MT53E2G64D8TN-046 WT:C Applications

The MT53E2G64D8TN-046 WT:C is ideal for a variety of applications, including:

  • Mobile Devices: Its low power consumption and high-speed performance make it suitable for smartphones, tablets, and other mobile devices where battery life and data processing speed are critical.
  • Embedded Systems: The compact form factor and high memory capacity make it an excellent choice for embedded systems in automotive, industrial, and IoT applications.
  • High-Performance Computing: The rapid access time and large memory size enable efficient data processing in high-performance computing environments, such as servers and data centers.
  • Consumer Electronics: The device's reliability and performance make it suitable for consumer electronics, including gaming consoles, smart TVs, and digital cameras.

Conclusion of MT53E2G64D8TN-046 WT:C

The MT53E2G64D8TN-046 WT:C is a versatile and high-performance LPDDR4 memory IC chip that offers significant advantages over similar models. Its combination of high-speed performance, large memory capacity, and low power consumption make it an ideal choice for a wide range of applications. Whether used in mobile devices, embedded systems, or high-performance computing environments, the MT53E2G64D8TN-046 WT:C delivers reliable and efficient performance, ensuring it remains a top choice for designers and engineers in the electronics industry.

FAQ

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