Micron Technology_MT53E512M64D2RR-046 WT:B
Micron Technology_MT53E512M64D2RR-046 WT:B
original

Micron Technology
MT53E512M64D2RR-046 WT:B

774-MT53E512M64D2RR-046 WT:B
PDF Datasheet
IC MEMORY DRAM 32G 512MX64 FBGA
6 Weeks

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Tech Specifications

Organization
512 M x 64
HTS
8542.32.00.36
ECCN (US)
EAR99
PPAP
No
Product Status
Active
Automotive
No
Supply Voltage - Min
1.06 V
Package / Case
WFBGA-556
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MT53E512M64D2RR-046 WT:B Description

MT53E512M64D2RR-046 WT:B Description

The MT53E512M64D2RR-046 WT:B is a high-performance 32GB DRAM memory IC chip, designed by Micron Technology Inc., a leading global provider of advanced semiconductor solutions. This memory chip features a 512M x 64-bit configuration, packaged in a fine-pitch ball grid array (FBGA) format. It is part of the MT53E512 base product series, known for its reliability and efficiency in various memory-intensive applications.

The MT53E512M64D2RR-046 WT:B is housed in a tray package, ensuring safe and efficient handling during manufacturing and assembly processes. It has a moisture sensitivity level (MSL) of 3, which means it can be exposed to ambient conditions for up to 168 hours without degradation, making it suitable for a wide range of manufacturing environments.

This memory IC chip is REACH unaffected and ROHS3 compliant, adhering to stringent environmental and regulatory standards. Its product status is active, ensuring continued availability and support from Micron Technology. Additionally, the DigiKey programmability status is not verified, indicating that custom programming options may need to be confirmed through additional channels.

MT53E512M64D2RR-046 WT:B Features

The MT53E512M64D2RR-046 WT:B offers several key features that set it apart from similar memory IC chips:

  • High Capacity and Density: With a 512M x 64-bit configuration, this chip provides a substantial 32GB of memory, making it ideal for applications requiring large data storage and processing capabilities.
  • Advanced Packaging: The FBGA package ensures high performance and reliability, with a compact footprint suitable for modern electronic devices.
  • Moisture Resistance: The MSL 3 rating allows for flexibility in manufacturing processes, reducing the risk of moisture-related damage.
  • Environmental Compliance: Being REACH unaffected and ROHS3 compliant, this chip meets the highest environmental standards, ensuring its suitability for global markets.
  • Active Product Status: As an active product, customers can rely on consistent availability and ongoing support from Micron Technology.

MT53E512M64D2RR-046 WT:B Applications

The MT53E512M64D2RR-046 WT:B is well-suited for a variety of applications, particularly those requiring high memory capacity and performance:

  • Data Centers: Ideal for server applications where large amounts of data need to be processed and stored efficiently.
  • High-Performance Computing (HPC): Suitable for applications such as scientific simulations, artificial intelligence, and machine learning, where high memory bandwidth and capacity are critical.
  • Networking Equipment: Provides the necessary memory for routers, switches, and other networking devices that handle large volumes of data traffic.
  • Consumer Electronics: Can be used in high-end gaming consoles, smart TVs, and other consumer devices that require significant memory to deliver seamless user experiences.

Conclusion of MT53E512M64D2RR-046 WT:B

The MT53E512M64D2RR-046 WT:B is a robust and reliable memory IC chip, offering 32GB of DRAM in a compact and efficient FBGA package. Its high capacity, advanced packaging, and environmental compliance make it a standout choice for a wide range of applications, from data centers to consumer electronics. With its active product status and support from Micron Technology, this chip is a reliable solution for modern memory needs.

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