Micron Technology

MT60B4G4HB-48B:A

MT60B4G4HB-48B:A Description

The MT60B4G4HB-48B:A is a high-performance DDR5 SDRAM module from Micron Technology Inc., offering a 16Gbit (4G x 4) memory organization with a parallel interface. Designed for demanding computing environments, this volatile memory operates at a 2.4 GHz clock frequency, ensuring rapid data access and transfer rates. The device is packaged in a surface-mount FBGA (Fine-Pitch Ball Grid Array) format, making it suitable for compact, high-density PCB designs. With an operating temperature range of 0°C to 95°C, it is engineered for reliability in industrial and enterprise applications.

MT60B4G4HB-48B:A Features

• Memory Size & Organization: 16Gbit (4G x 4) configuration, optimized for high-bandwidth applications.
• Clock Frequency: 2.4 GHz operation, enabling faster data processing compared to DDR4 alternatives.
• Memory Interface: Parallel interface for efficient data throughput in multi-channel systems.
• Temperature Resilience: Operates reliably in 0°C to 95°C, suitable for industrial and embedded systems.
• Mounting & Packaging: Surface-mount FBGA for space-constrained designs, shipped in a box package.
• DDR5 Advantages: Lower power consumption, higher bandwidth, and improved signal integrity over DDR4.
• Last Time Buy Status: Ideal for legacy system upgrades or final production runs.

MT60B4G4HB-48B:A Applications

• Data Centers: High-speed memory for servers, storage arrays, and cloud computing infrastructure.
• Networking Equipment: Routers, switches, and 5G base stations requiring low-latency DDR5 performance.
• Industrial Automation: Robust operation in harsh environments, such as robotics and control systems.
• AI/ML Hardware: Accelerates data-intensive workloads in GPUs and AI accelerators.
• Embedded Systems: Space-efficient memory for medical devices, automotive computing, and IoT edge devices.

Conclusion of MT60B4G4HB-48B:A

The MT60B4G4HB-48B:A DDR5 DRAM module stands out for its high-speed 2.4 GHz operation, 16Gbit density, and industrial-grade thermal resilience. Its parallel interface and FBGA packaging make it a versatile choice for next-gen computing, networking, and embedded applications. While marked as Last Time Buy, it remains a compelling solution for upgrading legacy systems or finalizing high-performance designs. For engineers seeking low-power, high-bandwidth memory, this Micron module delivers exceptional value in advanced electronic systems.