Micron Technology
MT61K512M32KPA-16:C  
Memory ICs Products

Micron Technology
MT61K512M32KPA-16:C
774-MT61K512M32KPA-16:C
Ersa
Micron Technology-MT61K512M32KPA-16:C-datasheets-2831335.pdf
GDDR6 16G 512MX32 FBGA DDP
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MT61K512M32KPA-16:C Description

MT61K512M32KPA-16:C Description

The MT61K512M32KPA-16:C is a high-performance 16Gbit GDDR6 DRAM from Micron Technology, designed for demanding computing and graphics applications. Organized as 512M x 32, it delivers a clock frequency of 8 GHz with a POD_135 (Pseudo Open Drain) memory interface, ensuring high-speed data transfer and low latency. Operating within a 1.3095V–1.3905V supply range, it balances power efficiency with performance. The device is RoHS3 compliant, REACH unaffected, and rated for 0°C to 95°C (TC), making it suitable for industrial and commercial environments. Packaged in a FBGA (Fine-Pitch Ball Grid Array) for surface-mount applications, it supports DDP (Dual Die Package) configurations for enhanced density.

MT61K512M32KPA-16:C Features

  • High-Speed Performance: 8 GHz clock frequency enables ultra-fast data processing for graphics and AI workloads.
  • Large Capacity: 16Gbit (512M x 32) organization provides ample memory for high-resolution rendering and complex computations.
  • Advanced Interface: POD_135 signaling reduces power consumption while maintaining signal integrity at high speeds.
  • Robust Operating Range: 1.3095V–1.3905V supply voltage and 0°C–95°C (TC) tolerance ensure reliability in varied conditions.
  • Compact Design: FBGA package with MSL 3 (168 hours) moisture sensitivity, ideal for space-constrained PCB layouts.
  • Compliance: RoHS3, REACH, and ECCN 3A991B1A certified for global market compatibility.

MT61K512M32KPA-16:C Applications

  • Graphics Processing Units (GPUs): Optimized for high-end gaming, VR, and professional visualization systems.
  • Artificial Intelligence (AI) Accelerators: Supports high-bandwidth memory requirements for deep learning and neural networks.
  • Data Center Hardware: Ideal for servers and high-performance computing (HPC) applications requiring low-latency memory.
  • Automotive Displays & ADAS: Meets stringent thermal and performance demands for next-gen vehicle systems.
  • Consumer Electronics: Enhances 4K/8K video processing and real-time rendering in smart TVs and media devices.

Conclusion of MT61K512M32KPA-16:C

The MT61K512M32KPA-16:C stands out as a high-speed, high-density GDDR6 solution for cutting-edge applications. Its 8 GHz bandwidth, efficient POD_135 interface, and robust thermal performance make it superior to older GDDR5/X variants. Whether for AI, GPUs, or data centers, this DRAM combines capacity, speed, and reliability, positioning it as a top choice for engineers designing next-generation systems. Micron’s adherence to RoHS3 and REACH standards further ensures its suitability for global deployments.

Tech Specifications

Clock Frequency
Operating Temperature
Memory Interface
ECCN
Memory Organization
Mounting Type
Memory Type
Product Status
Supplier Device Package
Series
Write Cycle Time - Word, Page
Memory Size
Package / Case
Technology
Voltage - Supply
REACH Status
Mfr
HTSUS
Package
Memory Format
RoHS Status
Moisture Sensitivity Level (MSL)
Mounting Style
Organization
Data Bus Width
Supply Current - Max
Supply Voltage - Min
Minimum Operating Temperature
Type
Moisture Sensitive
Maximum Clock Frequency
Maximum Operating Temperature
Supply Voltage - Max
USHTS

MT61K512M32KPA-16:C Documents

Download datasheets and manufacturer documentation for MT61K512M32KPA-16:C

Ersa Product Change Notification (PDF)      

Shopping Guide

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