Micron Technology_MT62F768M32D2DS-023 WT:B TR
Micron Technology_MT62F768M32D2DS-023 WT:B TR
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Micron Technology
MT62F768M32D2DS-023 WT:B TR

774-MT62F768M32D2DS-023 WT:B TR
LPDDR5 24GBIT 32 315/315 TFBGA
6 Weeks

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Tech Specifications

Clock Frequency
4.266 GHz
Operating Temperature
-25°C ~ 85°C (TC)
Memory Interface
LVSTL
Memory Organization
768M x 32
Mounting Type
Surface Mount
Memory Type
Volatile
Product Status
Active
Supplier Device Package
315-TFBGA (12.4x15)
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MT62F768M32D2DS-023 WT:B TR Description

This electronic part puts Tape & Reel (TR) method in the first place. Packaging method of this MT62F768M32D2DS-023 WT:B TR aims to use on multiple product types and build brand identity. This MT62F768M32D2DS-023 WT:B TR is produced by this Micron Technology and this manufacturer aims to provide original and genuine products to consumers. The vision of this Micron Technology establishes a strong ability to deliver goods in stock and meet customers' needs for one-stop procurement. This MT62F768M32D2DS-023 WT:B TR is a member of Memory ICs Products category. It falls under the category of Memory IC Chips. Any integrated circuit with the capability to store bits of data in memory cells within a memory array. The main function of memory IC is the storing and retrieval of such electronic data. This MT62F768M32D2DS-023 WT:B TR is mainly applied in memory-based electronic devices such as mobile phones, computers, tablets, medical devices, smart cards, digital cameras, communication equipment, and other digital electronic devices.

FAQ

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