Micron Technology_N25Q032A13E1240E

Micron Technology
N25Q032A13E1240E  
Memory ICs Products

Micron Technology
N25Q032A13E1240E
774-N25Q032A13E1240E
IC FLASH 32MBIT SPI 24TPBGA
In Stock : 7084

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N25Q032A13E1240E Description

N25Q032A13E1240E Description

The N25Q032A13E1240E is a high-performance 32Mbit (8M x 4) SPI NOR Flash memory device from Micron Technology Inc., designed for embedded systems requiring reliable, high-speed non-volatile storage. Operating at a 108 MHz clock frequency, it delivers fast read/write operations with a 2.7V–3.6V supply voltage, making it suitable for low-power applications. The device features a SPI interface, ensuring compatibility with a wide range of microcontrollers and processors. Organized as 8M x 4, it supports efficient data handling with 8ms word and 5ms page write cycle times. Packaged in a 24-TPBGA (Thin Profile Fine-Pitch Ball Grid Array), it is optimized for surface-mount designs in space-constrained environments.

N25Q032A13E1240E Features

  • High-Speed SPI Interface: Supports 108 MHz operation for rapid data transfer.
  • Low-Power Operation: 2.7V–3.6V range ideal for battery-powered devices.
  • Robust Memory Organization: 8M x 4 structure balances density and performance.
  • Fast Write Cycles: 8ms (word) / 5ms (page) for efficient programming.
  • Compact Form Factor: 24-TPBGA package saves PCB space.
  • Industrial Compliance: ROHS3 Compliant and REACH Unaffected, meeting environmental standards.
  • Extended Temperature Support: Suitable for harsh operating conditions.

N25Q032A13E1240E Applications

This SPI NOR Flash is ideal for:

  • Embedded Systems: Firmware storage in IoT devices, industrial controllers, and automotive ECUs.
  • Consumer Electronics: Code execution (XIP) in smart appliances, wearables, and set-top boxes.
  • Networking Equipment: Boot code and configuration storage in routers/switches.
  • Medical Devices: Secure, high-reliability data storage in portable diagnostics.
  • Aerospace & Defense: Ruggedized memory for avionics and mission-critical systems.

Conclusion of N25Q032A13E1240E

The N25Q032A13E1240E stands out for its high-speed SPI interface, low-power operation, and compact footprint, making it a versatile choice for demanding embedded applications. While marked obsolete, its performance and reliability ensure continued suitability for legacy designs or systems requiring proven flash memory solutions. Engineers should evaluate alternatives for new designs but can leverage this device’s strengths in existing deployments.

Tech Specifications

Clock Frequency
Operating Temperature
Memory Interface
ECCN
Memory Organization
Mounting Type
Memory Type
Product Status
Supplier Device Package
Series
Write Cycle Time - Word, Page
Memory Size
Package / Case
Technology
Voltage - Supply
REACH Status
Mfr
HTSUS
Package
Memory Format
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Program Current (mA)
PCB changed
HTS
ECCN (US)
Programming Voltage (V)
PPAP
Operating Current (mA)
Automotive
Command Compatible
Address Bus Width (bit)
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Supplier Package
Chip Density (bit)
Process Technology
Timing Type
Package Height
Maximum Operating Supply Voltage (V)
EU RoHS
Maximum Programming Time (ms)
Interface Type
Maximum Erase Time (s)
Sector Size
Boot Block
Number of Words
Number of Bits/Word (bit)
ECC Support
Location of Boot Block
Architecture
Block Organization
Support of Page Mode
Page Size
Minimum Endurance (Cycles)
Package Length
Supplier Temperature Grade
Standard Package Name
Cell Type
Pin Count
Mounting
Max. Access Time (ns)
Maximum Operating Frequency (MHz)
Lead Shape
Part Status
Typical Operating Supply Voltage (V)
Package Width
Programmability
Minimum Operating Supply Voltage (V)

N25Q032A13E1240E Documents

Download datasheets and manufacturer documentation for N25Q032A13E1240E

Shopping Guide

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