Micron Technology_NAND256W3A2BN6E
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Micron Technology
NAND256W3A2BN6E

774-NAND256W3A2BN6E
IC FLASH 256MBIT PARALLEL 48TSOP

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Tech Specifications

Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Parallel
ECCN
3A991B1A
Memory Organization
32M x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
48-TSOP
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NAND256W3A2BN6E Description

NAND256W3A2BN6E Description

The NAND256W3A2BN6E is a high-performance, 256Mbit parallel NAND flash memory IC from Micron Technology Inc., designed for applications requiring high-density storage and fast data access. With a memory organization of 32M x 8, this device offers a total memory capacity of 256Mbit, making it suitable for a wide range of applications in the electronics industry.

NAND256W3A2BN6E Features

  • Memory Interface: Parallel, providing fast data transfer rates and compatibility with existing parallel memory systems.
  • Memory Organization: 32M x 8, offering a total memory capacity of 256Mbit.
  • Access Time: 50 ns, ensuring rapid data retrieval and processing.
  • Write Cycle Time - Word, Page: 50 ns, allowing for quick data updates and writes.
  • Memory Size: 256Mbit, providing ample storage capacity for various applications.
  • Voltage - Supply: 2.7V ~ 3.6V, supporting a wide range of power supply requirements.
  • RoHS Status: ROHS3 Compliant, ensuring environmental compliance and reducing the environmental impact of the product.
  • REACH Status: REACH Unaffected, indicating that the product does not contain any substances of very high concern (SVHCs) listed under the European REACH regulation.
  • Moisture Sensitivity Level (MSL): 3 (168 Hours), ensuring reliable performance in various environmental conditions.

NAND256W3A2BN6E Applications

The NAND256W3A2BN6E is ideal for a variety of applications where high-density storage and fast data access are required. Some specific use cases include:

  1. Embedded Systems: In devices such as IoT devices, industrial controllers, and automotive systems, where high-density storage and fast data access are crucial for efficient operation.
  2. Consumer Electronics: In devices like digital cameras, MP3 players, and gaming consoles, where large amounts of data need to be stored and accessed quickly.
  3. Data Storage Devices: In applications such as solid-state drives (SSDs) and USB flash drives, where high-density storage and fast data transfer rates are essential.

Conclusion of NAND256W3A2BN6E

The NAND256W3A2BN6E is a high-performance, 256Mbit parallel NAND flash memory IC from Micron Technology Inc., offering a combination of high-density storage, fast data access, and environmental compliance. Its unique features, such as parallel memory interface, 32M x 8 memory organization, and 50 ns access time, make it an ideal choice for a wide range of applications in the electronics industry. However, it is important to note that this product is now considered obsolete, and alternative solutions may be required for new designs.

FAQ

What package or case is NAND256W3A2BN6E available in?
NAND256W3A2BN6E is available in the 48-TFSOP (0.724", 18.40mm Width) package / case.
What operating temperature range does NAND256W3A2BN6E support?
What is NAND256W3A2BN6E?
What voltage specification is listed for NAND256W3A2BN6E?
What is the mounting type of NAND256W3A2BN6E?
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