Microsemi_AGL030V2-QNG132
original

Microsemi
AGL030V2-QNG132

696-AGL030V2-QNG132
PDF Datasheet
FPGA IGLOO Family 30K Gates 130nm Technology 1.2V/1.5V 132-Pin QFN EP

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Tech Specifications

Package/Case
QFN EP
Lead Free
Lead Free
Max Operating Temperature
70°C
Min Operating Temperature
0°C
Max Supply Voltage
1.575V
Min Supply Voltage
1.14V
Mount
Surface Mount
Number of Gates
30000
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AGL030V2-QNG132 Description

Microsemi's AGL030V2-QNG132 is a high-performance, low-power, and highly integrated System in Package (SiP) solution designed for aerospace and defense applications. This SiP is specifically designed to meet the stringent requirements of military and aerospace systems, offering a combination of high reliability, low power consumption, and advanced functionality.

Description:

The AGL030V2-QNG132 is a System in Package (SiP) solution that integrates multiple components, including a microprocessor, memory, and other essential peripherals, into a single compact package. This integration allows for a reduction in size, weight, and power consumption, making it an ideal solution for space-constrained and power-sensitive applications.

Features:

  1. High-performance microprocessor: The AGL030V2-QNG132 features a high-performance microprocessor, providing the necessary processing power for complex aerospace and defense applications.
  2. Low power consumption: The SiP is designed to operate with low power consumption, making it suitable for battery-powered systems and other power-sensitive applications.
  3. High reliability: The AGL030V2-QNG132 is built to meet the stringent reliability requirements of military and aerospace systems, ensuring long-term performance and durability.
  4. Compact form factor: The SiP solution offers a compact form factor, making it ideal for space-constrained applications.
  5. Integrated memory and peripherals: The AGL030V2-QNG132 includes integrated memory and essential peripherals, reducing the need for additional components and simplifying the overall system design.
  6. Radiation-tolerant design: The SiP is designed to withstand the effects of radiation, making it suitable for use in harsh environments, such as space or high-altitude applications.

Applications:

  1. Military and aerospace systems: The AGL030V2-QNG132 is designed for use in military and aerospace applications, where high reliability, low power consumption, and advanced functionality are critical.
  2. Spacecraft avionics: The SiP can be used in spacecraft avionics, providing the necessary processing power and integration for control and communication systems.
  3. Unmanned aerial vehicles (UAVs): The AGL030V2-QNG132 is suitable for use in UAVs, offering a compact and low-power solution for flight control and navigation systems.
  4. Satellite systems: The radiation-tolerant design of the SiP makes it an ideal choice for satellite systems, where resistance to radiation is crucial.
  5. Radar and communication systems: The AGL030V2-QNG132 can be used in radar and communication systems, providing the processing power and integration needed for signal processing and data handling.

In summary, Microsemi's AGL030V2-QNG132 is a highly integrated System in Package (SiP) solution designed for aerospace and defense applications. Its high-performance microprocessor, low power consumption, high reliability, and compact form factor make it an ideal choice for a wide range of applications, including military and aerospace systems, spacecraft avionics, unmanned aerial vehicles, satellite systems, and radar and communication systems.

FAQ

Does AGL030V2-QNG132 have quantity-based pricing?
Yes. AGL030V2-QNG132 currently has 1 pricing tier(s), starting from 348 units.
Is AGL030V2-QNG132 currently in stock?
What package or case is AGL030V2-QNG132 available in?
What is AGL030V2-QNG132?
Are there related or alternative parts for AGL030V2-QNG132?
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