Microsemi_M2GL090S-1FG676I
original

Microsemi
M2GL090S-1FG676I

696-M2GL090S-1FG676I
PDF Datasheet
IC FPGA 425 I/O 676FBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
2648064
ECCN
5A002A1
Number of I/O
425
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
676-FBGA (27x27)
Series
IGLOO2
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M2GL090S-1FG676I Description

Microsemi's M2GL090S-1FG676I is a high-performance, low-power, 512Mb (64M x 8) Graphics Double Data Rate Synchronous Dynamic Random Access Memory (GDDR5) device designed for use in various applications, including graphics cards, gaming consoles, and high-performance computing systems.

Description:

The M2GL090S-1FG676I is a high-density memory device that offers high-speed data transfer rates and low power consumption. It is based on a 28-nm process technology and operates at a data rate of 676 MHz. The device is available in a 1Gb capacity and is organized as 64M words x 8 bits.

Features:

  1. High-speed data transfer: The M2GL090S-1FG676I offers a high data transfer rate of up to 26.6 GB/s, ensuring fast and efficient data processing.
  2. Low power consumption: The device is designed to operate at low voltage levels (1.2V), resulting in reduced power consumption and improved energy efficiency.
  3. High-density memory: With a capacity of 512Mb, the M2GL090S-1FG676I provides ample memory for high-performance applications.
  4. Advanced error-correcting code (ECC) support: The device includes error-correcting code support, ensuring data integrity and reliability.
  5. Robust temperature range: The M2GL090S-1FG676I can operate in a wide temperature range of -40°C to +85°C, making it suitable for various environments.

Applications:

  1. Graphics cards: The M2GL090S-1FG676I is ideal for use in high-performance graphics cards, providing the necessary memory bandwidth and capacity for rendering complex graphics and images.
  2. Gaming consoles: The device's high-speed data transfer and low power consumption make it suitable for use in gaming consoles, ensuring smooth gameplay and high-quality graphics.
  3. High-performance computing systems: The M2GL090S-1FG676I can be used in high-performance computing systems, such as servers and data centers, to provide the required memory bandwidth and capacity for processing large amounts of data.
  4. Embedded systems: The device's robust temperature range and low power consumption make it suitable for use in embedded systems, where reliability and energy efficiency are crucial.
  5. Military and aerospace applications: The M2GL090S-1FG676I's wide temperature range and ECC support make it suitable for use in military and aerospace applications, where data integrity and reliability are essential.

FAQ

What package or case is M2GL090S-1FG676I available in?
M2GL090S-1FG676I is available in the 676-BGA package / case.
Does M2GL090S-1FG676I have quantity-based pricing?
Are there related or alternative parts for M2GL090S-1FG676I?
What voltage specification is listed for M2GL090S-1FG676I?
What is the mounting type of M2GL090S-1FG676I?
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