Microsemi_M2GL100T-1FCG1152I
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Microsemi
M2GL100T-1FCG1152I

696-M2GL100T-1FCG1152I
PDF Datasheet
IC FPGA 574 I/O 1152FCBGA

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Tech Specifications

Operating Temperature
-40°C ~ 100°C (TJ)
Total RAM Bits
3637248
ECCN
3A001A7A
Number of I/O
574
Mounting Type
Surface Mount
Product Status
Obsolete
Supplier Device Package
1152-FCBGA (35x35)
Series
IGLOO2
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M2GL100T-1FCG1152I Description

The Microsemi M2GL100T-1FCG1152I is a high-performance, low-power, and high-density memory device designed for use in a wide range of applications. Here is a description of the model, its features, and potential applications:

Description:

The M2GL100T-1FCG1152I is a 128Mb (16M x 8) low-power SRAM (Static Random Access Memory) device, manufactured using Microsemi's advanced 110nm process technology. This memory device is available in a 115-ball fine-pitch ball grid array (FBGA) package, making it suitable for high-density and compact electronic systems.

Features:

  1. High Performance: The M2GL100T-1FCG1152I offers high-speed operation with a typical access time of 8 ns, ensuring fast data processing and retrieval.
  2. Low Power Consumption: This memory device is designed for low power applications, with a typical operating current of 80 mA (3.3V).
  3. High Density: With a storage capacity of 128Mb, the M2GL100T-1FCG1152I provides a high-density memory solution for various applications.
  4. Wide Operating Voltage Range: The device operates over a wide voltage range of 2.7V to 3.6V, making it suitable for different power supply requirements.
  5. Industrial Temperature Range: The M2GL100T-1FCG1152I is designed to operate in the industrial temperature range of -40°C to +85°C, ensuring reliable performance in various environmental conditions.
  6. Advanced 110nm Process Technology: Manufactured using Microsemi's advanced 110nm process technology, the device offers improved performance, reduced power consumption, and higher integration.

Applications:

The M2GL100T-1FCG1152I is suitable for a wide range of applications due to its high performance, low power consumption, and high-density memory capabilities. Some potential applications include:

  1. Networking and Communication Systems: The device can be used in networking equipment, routers, and switches for high-speed data processing and storage.
  2. Industrial Automation and Control Systems: The M2GL100T-1FCG1152I can be utilized in industrial control systems for reliable and efficient data storage and retrieval.
  3. Video Processing and Surveillance: This memory device can be used in video processing systems and surveillance equipment for high-quality image storage and processing.
  4. Medical Imaging and Diagnostic Equipment: The M2GL100T-1FCG1152I can be employed in medical imaging systems for fast and reliable storage of high-resolution images.
  5. Aerospace and Defense Systems: The device's ability to operate in extreme temperature ranges makes it suitable for aerospace and defense applications, where reliability and performance are crucial.
  6. Consumer Electronics: The M2GL100T-1FCG1152I can be used in various consumer electronics, such as gaming consoles, set-top boxes, and advanced imaging devices, for high-speed data processing and storage.

In summary, the Microsemi M2GL100T-1FCG1152I is a high-performance, low-power, and high-density memory device that offers a wide range of features suitable for various applications, including networking, industrial automation, video processing, medical imaging, aerospace, and consumer electronics.

FAQ

What is the mounting type of M2GL100T-1FCG1152I?
M2GL100T-1FCG1152I uses a Surface Mount mounting style based on the listed product specifications.
Are there related or alternative parts for M2GL100T-1FCG1152I?
What voltage specification is listed for M2GL100T-1FCG1152I?
Is M2GL100T-1FCG1152I currently in stock?
What package or case is M2GL100T-1FCG1152I available in?
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