NXP Semiconductors
LPC1317FBD64,551  
Microcontrollers

NXP Semiconductors
LPC1317FBD64,551
685-LPC1317FBD64,551
Ersa
NXP Semiconductors-LPC1317FBD64,551-datasheets-3615808.pdf
IC MCU 32BIT 64KB FLASH 64LQFP
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LPC1317FBD64,551 Description

The LPC1317FBD64,551 is a microcontroller unit (MCU) developed by NXP Semiconductors. It belongs to the LPC1300 series of MCUs, which are designed for low-power and high-performance applications.

Description:

The LPC1317FBD64,551 is a 32-bit ARM Cortex-M0 based MCU with a clock speed of up to 50 MHz. It features 64 KB of on-chip flash memory and 16 KB of SRAM. The MCU is available in a 64-pin LQFP package.

Features:

  1. ARM Cortex-M0 processor with a clock speed of up to 50 MHz.
  2. 64 KB of on-chip flash memory and 16 KB of SRAM.
  3. 48 general-purpose I/O pins with support for various communication protocols.
  4. Advanced analog-to-digital converter (ADC) with up to 12-bit resolution.
  5. Flexible clock control with support for external and internal oscillators.
  6. Support for USB 2.0 full-speed device/host/OTG functionality.
  7. Integrated DMA controller for efficient data transfer.
  8. Support for various power-saving modes to extend battery life in portable applications.

Applications:

The LPC1317FBD64,551 is suitable for a wide range of applications due to its low-power consumption, high performance, and flexible features. Some of the potential applications include:

  1. Industrial control systems: The LPC1317FBD64,551 can be used in industrial control systems for monitoring and controlling various parameters, such as temperature, pressure, and humidity.

  2. Medical devices: The MCU can be used in portable medical devices, such as glucometers and blood pressure monitors, due to its low-power consumption and integrated ADC.

  3. Consumer electronics: The LPC1317FBD64,551 can be used in portable consumer electronics, such as fitness trackers and smart watches, for data processing and communication with other devices.

  4. Automotive applications: The MCU can be used in automotive applications, such as infotainment systems and body control modules, due to its robustness and support for various communication protocols.

  5. IoT devices: The LPC1317FBD64,551 can be used in Internet of Things (IoT) devices, such as smart home appliances and environmental monitoring systems, for data processing and communication with other devices.

  6. Embedded systems: The MCU can be used in embedded systems for various applications, such as motor control, sensing, and data acquisition, due to its flexible features and low-power consumption.

Tech Specifications

Program Memory Type
PPAP
Data Bus Width (bit)
Product Status
SPI
Automotive
EEPROM Size
Supplier Package
Package / Case
Instruction Set Architecture
Core Architecture
REACH Status
Family Name
Maximum Operating Supply Voltage (V)
Maximum Clock Rate (MHz)
EU RoHS
Moisture Sensitivity Level (MSL)
Operating Temperature
ECCN
Mounting Type
Standard Package Name
Oscillator Type
Pin Count
Mounting
CAN
USART
Lead Shape
Core Size
Ethernet
Connectivity
Program Memory Size
Typical Operating Supply Voltage (V)
HTSUS
Package
Data Converters
Programmability
Core Processor
PCB changed
HTS
ECCN (US)
Maximum Power Dissipation (mW)
Device Core
Supplier Device Package
ADC Channels
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
No. of Timers
Package Height
Mfr
I2C
Voltage - Supply (Vcc/Vdd)
Interface Type
RoHS Status
Maximum CPU Frequency (MHz)
Speed
Number of ADCs
USB
RAM Size
Number of I/O
UART
Peripherals
I2S
Package Length
ADC Resolution (bit)
Series
Watchdog
Part Status
Number of I/Os
Package Width
Base Product Number
Minimum Operating Supply Voltage (V)
Mounting Style
Unit Weight
Data Bus Width
ADC Resolution
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Processor Series
Moisture Sensitive
Maximum Clock Frequency
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Data RAM Size
Core

LPC1317FBD64,551 Documents

Download datasheets and manufacturer documentation for LPC1317FBD64,551

Ersa LPC1315-17, LPC1345-47 Datasheet      
Ersa All Dev Label Update 15/Dec/2020       Mult Dev Pkg Seal 15/Dec/2020      
Ersa NXP USA Inc REACH       NXP USA Inc RoHS Cert      

Shopping Guide

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