onsemi
FDMS86163P  
Single FETs, MOSFETs

onsemi
FDMS86163P
278-FDMS86163P
Ersa
onsemi-FDMS86163P-datasheets-11430035.pdf
MOSFET P-CH 100V 7.9A/50A 8PQFN
In Stock : 4705

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FDMS86163P Description

The FDMS86163P is a high-performance, high-voltage, integrated gate-commutated (IGC) driver from ON Semiconductor. It is designed to drive high-voltage power MOSFETs and IGBTs in a wide range of applications, including motor control, power supplies, and renewable energy systems.

Description:

The FDMS86163P is a monolithic integrated circuit that provides all the necessary gate drive functions for high-voltage power MOSFETs and IGBTs. It includes a high-voltage charge pump, a gate driver with independent control of the turn-on and turn-off rates, and a comprehensive set of protection features.

Features:

  1. High-Voltage Operation: The FDMS86163P can operate from supply voltages up to 60V, making it suitable for driving high-voltage power MOSFETs and IGBTs.
  2. Independent Gate Drive Control: The device features independent control of the turn-on and turn-off rates, allowing for precise control of the switching behavior of the power MOSFETs and IGBTs.
  3. Charge Pump: The integrated charge pump allows for efficient use of the supply voltage and reduces the number of external components required.
  4. Protection Features: The FDMS86163P includes a range of protection features, including overcurrent protection, overvoltage protection, and undervoltage lockout.
  5. Small Package: The device is available in a compact SOIC-8 package, making it suitable for space-constrained applications.

Applications:

The FDMS86163P is suitable for a wide range of applications, including:

  1. Motor Control: The device can be used to drive high-voltage power MOSFETs and IGBTs in brushless DC motor controllers, stepper motor controllers, and AC motor controllers.
  2. Power Supplies: The FDMS86163P can be used to drive high-voltage power MOSFETs and IGBTs in power supply applications, such as switched-mode power supplies (SMPS) and uninterruptible power supplies (UPS).
  3. Renewable Energy Systems: The device can be used to drive high-voltage power MOSFETs and IGBTs in renewable energy systems, such as solar inverters and wind turbine converters.
  4. Electric Vehicles: The FDMS86163P can be used to drive high-voltage power MOSFETs and IGBTs in electric vehicle (EV) applications, such as traction motor controllers and battery chargers.

In summary, the FDMS86163P is a versatile, high-performance gate driver that is suitable for a wide range of high-voltage power applications. Its independent gate drive control, integrated charge pump, and comprehensive set of protection features make it an ideal choice for driving high-voltage power MOSFETs and IGBTs in demanding applications.

Tech Specifications

FET Type
Input Capacitance (Ciss) (Max) @ Vds
Gate Charge (Qg) (Max) @ Vgs
Product Status
Supplier Device Package
Drain to Source Voltage (Vdss)
Power Dissipation (Max)
Package / Case
Technology
REACH Status
Mfr
Vgs (Max)
RoHS Status
Moisture Sensitivity Level (MSL)
Operating Temperature
FET Feature
ECCN
Mounting Type
Rds On (Max) @ Id, Vgs
Vgs(th) (Max) @ Id
Series
Current - Continuous Drain (Id) @ 25°C
Drive Voltage (Max Rds On, Min Rds On)
HTSUS
Package
Base Product Number
Configuration
Typical Turn-Off Delay Time (ns)
Maximum Gate Source Leakage Current (nA)
Typical Rise Time (ns)
PPAP
Channel Mode
Typical Turn-On Delay Time (ns)
Automotive
Supplier Package
Maximum IDSS (uA)
Channel Type
EU RoHS
Maximum Continuous Drain Current (A)
Maximum Pulsed Drain Current @ TC=25°C (A)
Maximum Drain Source Voltage (V)
Maximum Drain Source Resistance (mOhm)
Standard Package Name
Typical Reverse Recovery Charge (nC)
Maximum Continuous Drain Current on PCB @ TC=25°C (A)
Pin Count
Mounting
Minimum Gate Threshold Voltage (V)
Typical Reverse Transfer Capacitance @ Vds (pF)
Lead Shape
Typical Gate to Drain Charge (nC)
SVHC
Typical Gate Charge @ Vgs (nC)
Typical Input Capacitance @ Vds (pF)
Maximum Power Dissipation on PCB @ TC=25°C (W)
Category
Maximum Gate Resistance (Ohm)
PCB changed
HTS
Number of Elements per Chip
Typical Reverse Recovery Time (ns)
ECCN (US)
Maximum Power Dissipation (mW)
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Typical Fall Time (ns)
Process Technology
Package Height
Typical Gate to Source Charge (nC)
Maximum Positive Gate Source Voltage (V)
Minimum Gate Resistance (Ohm)
Typical Gate Threshold Voltage (V)
Maximum Gate Source Voltage (V)
SVHC Exceeds Threshold
Typical Gate Plateau Voltage (V)
Package Length
Typical Gate Charge @ 10V (nC)
Maximum Diode Forward Voltage (V)
Typical Diode Forward Voltage (V)
Operating Junction Temperature (°C)
Typical Output Capacitance (pF)
Part Status
Maximum Gate Threshold Voltage (V)
Package Width
Maximum Junction Ambient Thermal Resistance on PCB (°C/W)

FDMS86163P Documents

Download datasheets and manufacturer documentation for FDMS86163P

Ersa PQFN56 Wire Source 9/Dec/2020      
Ersa FDMS86163P      
Ersa Mult Devices 24/Oct/2017      
Ersa Logo 17/Aug/2017      
Ersa onsemi RoHS       onsemi REACH       Material Declaration FDMS86163P      

Shopping Guide

Payment Methods
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Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service