onsemi_FDN359AN

onsemi
FDN359AN  
Single FETs, MOSFETs

onsemi
FDN359AN
278-FDN359AN
Ersa
onsemi-FDN359AN-datasheets-3366851.pdf
MOSFET N-CH 30V 2.7A SUPERSOT3
In Stock : 10248

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    FDN359AN Description

    FDN359AN is a high voltage N-channel MOSFET transistor manufactured by ON Semiconductor. It is designed for use in a variety of power electronics applications, including motor control, power supplies, and energy management systems.

    Description:

    The FDN359AN is a high voltage N-channel MOSFET transistor with a drain-source voltage (VDS) of -30V and a continuous drain current (ID) of 4.2A. It has a gate-source voltage (VGS) of -4.5V and a threshold voltage (VTH) of -2.5V. The device has a low on-state resistance (RDS(on)) of 4.5 milliohms, which allows for efficient power switching.

    Features:

    • High voltage N-channel MOSFET transistor
    • Drain-source voltage (VDS) of -30V
    • Continuous drain current (ID) of 4.2A
    • Gate-source voltage (VGS) of -4.5V
    • Threshold voltage (VTH) of -2.5V
    • Low on-state resistance (RDS(on)) of 4.5 milliohms
    • Suitable for use in a variety of power electronics applications

    Applications:

    The FDN359AN is commonly used in power electronics applications such as:

    • Motor control
    • Power supplies
    • Energy management systems
    • Inverters
    • Switch mode power supplies (SMPS)
    • Class D audio amplifiers
    • Battery management systems
    • Industrial control systems

    The FDN359AN is available in a TO-220 package, which is a popular choice for power electronics applications due to its ability to dissipate heat effectively. It is also available in other packages such as TO-247 and DPAK.

    It is important to note that the FDN359AN is a high voltage device and should be used with proper gate drive and heat sinking to ensure reliable operation. Additionally, it is recommended to consult the datasheet for detailed information on the device's electrical characteristics and operating conditions.

    Tech Specifications

    FET Type
    Input Capacitance (Ciss) (Max) @ Vds
    Gate Charge (Qg) (Max) @ Vgs
    Product Status
    Supplier Device Package
    Drain to Source Voltage (Vdss)
    Power Dissipation (Max)
    Package / Case
    Technology
    REACH Status
    Mfr
    Vgs (Max)
    RoHS Status
    Moisture Sensitivity Level (MSL)
    Operating Temperature
    FET Feature
    ECCN
    Mounting Type
    Rds On (Max) @ Id, Vgs
    Vgs(th) (Max) @ Id
    Series
    Current - Continuous Drain (Id) @ 25°C
    Drive Voltage (Max Rds On, Min Rds On)
    HTSUS
    Package
    Base Product Number
    Configuration
    Typical Turn-Off Delay Time (ns)
    Maximum Gate Source Leakage Current (nA)
    Typical Rise Time (ns)
    PPAP
    Channel Mode
    Typical Turn-On Delay Time (ns)
    Automotive
    Supplier Package
    Maximum IDSS (uA)
    Channel Type
    EU RoHS
    Maximum Continuous Drain Current (A)
    Maximum Pulsed Drain Current @ TC=25°C (A)
    Maximum Drain Source Voltage (V)
    Maximum Drain Source Resistance (mOhm)
    Standard Package Name
    Maximum Continuous Drain Current on PCB @ TC=25°C (A)
    Pin Count
    Mounting
    Minimum Gate Threshold Voltage (V)
    Typical Reverse Transfer Capacitance @ Vds (pF)
    Lead Shape
    Typical Gate to Drain Charge (nC)
    Typical Gate Charge @ Vgs (nC)
    Typical Input Capacitance @ Vds (pF)
    Maximum Power Dissipation on PCB @ TC=25°C (W)
    Category
    PCB changed
    HTS
    Number of Elements per Chip
    ECCN (US)
    Maximum Power Dissipation (mW)
    Minimum Operating Temperature (°C)
    Maximum Operating Temperature (°C)
    Typical Fall Time (ns)
    Process Technology
    Package Height
    Typical Gate to Source Charge (nC)
    Maximum Positive Gate Source Voltage (V)
    Typical Gate Threshold Voltage (V)
    Maximum Gate Source Voltage (V)
    Typical Gate Plateau Voltage (V)
    Package Length
    Typical Gate Charge @ 10V (nC)
    Maximum Diode Forward Voltage (V)
    Typical Diode Forward Voltage (V)
    Operating Junction Temperature (°C)
    Typical Output Capacitance (pF)
    Part Status
    Maximum Gate Threshold Voltage (V)
    Package Width
    Maximum Junction Ambient Thermal Resistance on PCB (°C/W)

    FDN359AN Documents

    Download datasheets and manufacturer documentation for FDN359AN

    Shopping Guide

    Payment Methods
    Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
    Shipping Rate
    Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
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