ROHM Semiconductor_BR25G128FJ-3GE2
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ROHM Semiconductor
BR25G128FJ-3GE2

774-BR25G128FJ-3GE2
PDF Datasheet
IC EEPROM 128KBIT SPI 8SOPJ
20 Weeks

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APAC
ISO9001
Quality Policy
ISO45001
ISO14001
Original

Tech Specifications

EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
NRND
HTS
8542.32.00.51
Automotive
No
PPAP
No
Chip Density (bit)
128K
Organization
16Kx8
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BR25G128FJ-3GE2 Description

BR25G128FJ-3GE2 Description

The BR25G128FJ-3GE2 is a high-performance EEPROM memory IC chip designed by Rohm Semiconductor. This device offers a memory size of 128 Kbit, organized in a 16K x 8 configuration, making it ideal for applications requiring reliable and efficient data storage. The chip operates with a clock frequency of 20 MHz, ensuring fast data access and transfer rates. It features a SPI memory interface, which is widely used in various electronic systems for its simplicity and efficiency.

The BR25G128FJ-3GE2 is designed for surface mount applications, providing a compact and reliable solution for modern electronics. It supports a wide supply voltage range of 1.6V to 5.5V, making it versatile for different power supply requirements. The write cycle time for a word or page is 5ms, ensuring quick data writing capabilities. The chip is packaged in a Tape & Reel (TR) format, which is suitable for automated assembly processes.

BR25G128FJ-3GE2 Features

  • Memory Size and Organization: 128 Kbit, organized as 16K x 8, providing ample storage for various applications.
  • Clock Frequency: 20 MHz, ensuring fast data access and transfer.
  • Memory Interface: SPI, a widely used interface for its simplicity and efficiency.
  • Supply Voltage: 1.6V to 5.5V, offering flexibility in power supply requirements.
  • Write Cycle Time: 5ms for word or page, enabling quick data writing.
  • Mounting Type: Surface Mount, suitable for compact and modern electronic designs.
  • Package: Tape & Reel (TR), ideal for automated assembly processes.
  • Moisture Sensitivity Level (MSL): 1 (Unlimited), ensuring reliability in various environmental conditions.
  • Compliance: REACH Unaffected and ROHS3 Compliant, meeting environmental and safety standards.

BR25G128FJ-3GE2 Applications

The BR25G128FJ-3GE2 is well-suited for a variety of applications where reliable and efficient data storage is crucial. Some specific use cases include:

  • Consumer Electronics: Ideal for devices requiring non-volatile memory for storing configuration data, such as smart home devices, IoT sensors, and wearable technology.
  • Industrial Automation: Suitable for industrial control systems where data integrity and quick access are critical.
  • Telecommunications: Useful in networking equipment for storing firmware and configuration data.
  • Medical Devices: Applicable in medical monitoring devices where reliable data storage and quick access are essential for patient care.

Conclusion of BR25G128FJ-3GE2

The BR25G128FJ-3GE2 from Rohm Semiconductor is a robust and versatile EEPROM memory IC chip, offering a combination of high performance and reliability. Its wide supply voltage range, fast clock frequency, and efficient SPI interface make it suitable for a wide range of applications. The compact surface mount design and Tape & Reel packaging ensure ease of integration into modern electronic systems. With its compliance to environmental and safety standards, the BR25G128FJ-3GE2 is an excellent choice for designers looking for a reliable and efficient memory solution.

FAQ

What is the mounting type of BR25G128FJ-3GE2?
BR25G128FJ-3GE2 uses a Surface Mount mounting style based on the listed product specifications.
What operating temperature range does BR25G128FJ-3GE2 support?
Does BR25G128FJ-3GE2 have quantity-based pricing?
What voltage specification is listed for BR25G128FJ-3GE2?
What package or case is BR25G128FJ-3GE2 available in?
Availability (In Stock : 1017 )
Quantity Unit Price Ext. Price
1+ $0.44880 $0.45
10+ $0.42240 $4.22
25+ $0.41149 $10.29
50+ $0.40286 $20.14
100+ $0.39406 $39.41
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