ROHM Semiconductor_BR93G76FVJ-3AGTE2
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ROHM Semiconductor
BR93G76FVJ-3AGTE2

774-BR93G76FVJ-3AGTE2
PDF Datasheet
IC EEPROM 8KBIT MICROWIRE 8TSSOP

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Tech Specifications

Clock Frequency
3 MHz
Operating Temperature
-40°C ~ 85°C (TA)
Memory Interface
Microwire
ECCN
EAR99
Memory Organization
512 x 16
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
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BR93G76FVJ-3AGTE2 Description

BR93G76FVJ-3AGTE2 Description

The BR93G76FVJ-3AGTE2 is an 8Kbit EEPROM Memory IC Chip manufactured by ROHM Semiconductor. This device is designed for surface mount applications and features a Microwire memory interface, making it suitable for a variety of embedded systems and industrial applications. The memory organization is 512 x 16, providing a robust storage solution with a clock frequency of 3 MHz. The BR93G76FVJ-3AGTE2 operates within a wide voltage range of 1.7V to 5.5V, ensuring compatibility with various power supply configurations. The write cycle time for a word or page is 5ms, ensuring efficient data handling. The device is packaged in a Tape & Reel (TR) format, which is ideal for automated assembly processes. Despite its obsolete status, the BR93G76FVJ-3AGTE2 remains a reliable choice for applications requiring non-volatile memory storage.

BR93G76FVJ-3AGTE2 Features

  • Memory Size and Organization: The BR93G76FVJ-3AGTE2 offers 8Kbit of EEPROM memory organized as 512 x 16, providing ample storage for critical data in embedded systems.
  • Wide Operating Voltage Range: With a supply voltage range of 1.7V to 5.5V, this IC can operate efficiently across a variety of power supply conditions, making it versatile for different applications.
  • Microwire Interface: The Microwire interface ensures reliable communication between the memory chip and the host system, facilitating easy integration into existing architectures.
  • Fast Write Cycle Time: The 5ms write cycle time for words and pages ensures that data can be written quickly and efficiently, reducing latency in data-intensive applications.
  • Surface Mount Technology: The surface mount mounting type allows for compact and reliable integration into PCB designs, enhancing the overall robustness of the system.
  • Compliance and Safety: The BR93G76FVJ-3AGTE2 is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and safety standards for electronic components.
  • Moisture Sensitivity Level: With an MSL of 1 (Unlimited), the device is suitable for storage and handling in various environmental conditions without the risk of moisture damage.

BR93G76FVJ-3AGTE2 Applications

The BR93G76FVJ-3AGTE2 is ideal for applications requiring reliable non-volatile memory storage with efficient data handling capabilities. Some specific use cases include:

  • Embedded Systems: Ideal for embedded systems where small form factor and efficient power consumption are critical, such as in IoT devices and smart sensors.
  • Industrial Control Systems: Suitable for industrial applications where robustness and reliability are paramount, such as in programmable logic controllers (PLCs) and automation systems.
  • Telecommunications: Can be used in telecommunication equipment for storing configuration data and firmware, ensuring quick and reliable access.
  • Consumer Electronics: Applicable in consumer electronics for storing user settings and preferences, enhancing the user experience by providing quick access to stored data.

Conclusion of BR93G76FVJ-3AGTE2

The BR93G76FVJ-3AGTE2 is a reliable and versatile EEPROM memory IC chip that offers a range of features and benefits suitable for various applications. Its wide operating voltage range, fast write cycle time, and Microwire interface make it an efficient choice for embedded systems and industrial applications. Despite its obsolete status, the BR93G76FVJ-3AGTE2 remains a robust solution for applications requiring non-volatile memory storage. Its compliance with environmental and safety standards ensures it meets the requirements of modern electronics manufacturing.

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