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BU4093BFV-E2

This electronic part uses a Tape & Reel (TR) method. The purpose of this BU4093BFV-E2 packaging is to shield things from moisture and stop the growth of mold and mildew. This BU4093BFV-E2 is manufactured by ROHM Semiconductor, which also produces a lot of these goods. The goal of ROHM Semiconductor is to share a passion in electronics field and keep moving to provide highest standards with many people around the world. This BU4093BFV-E2 belongs to the category Gates and Inverters and it is a portion of the Logic IC Chips. A logic IC is a semiconductor device. It implements a basic logical operation that is performed on one or more digital input signals. This BU4093BFV-E2 are widely used in microprocessors, computers, computer networks, frequency counters and digital signal processors. Other subcategories within this category include memory chips, interface ICs, logic OCs, and programmable ICs.