Silicon Motion_SM671PAB-ADST
original

Silicon Motion
SM671PAB-ADST

774-SM671PAB-ADST
IC FLASH 256GBIT UFS2.1 153BGA

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
Memory Interface
UFS3.1
ECCN
OBSOLETE
Memory Organization
32G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Obsolete
Supplier Device Package
153-BGA (11.5x13)
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SM671PAB-ADST Description

SM671PAB-ADST Description

The SM671PAB-ADST is a high-performance Memory IC Chip designed by Silicon Motion, Inc. This obsolete product offers a robust solution for applications requiring significant storage capacity and fast data transfer speeds. It features a 256Gbit (32GB x 8) memory organization with a UFS3.1 memory interface, ensuring compatibility with modern high-speed data processing systems. The SM671PAB-ADST is packaged in a 153-BGA format, making it suitable for surface mount applications and providing a compact footprint for space-constrained designs. The chip is RoHS3 compliant and has a moisture sensitivity level (MSL) of 3, allowing for up to 168 hours of exposure before reflow soldering.

SM671PAB-ADST Features

  • Memory Size and Organization: The SM671PAB-ADST boasts a 256Gbit memory size, organized as 32G x 8, providing ample storage for large datasets and applications requiring extensive memory.
  • Memory Interface: Equipped with a UFS3.1 interface, this chip ensures high-speed data transfer rates, making it ideal for applications that demand rapid data processing and low latency.
  • Surface Mount Compatibility: The surface mount mounting type and 153-BGA package make the SM671PAB-ADST suitable for integration into compact and high-density PCB designs.
  • Environmental Compliance: The RoHS3 compliance ensures that the SM671PAB-ADST meets stringent environmental standards, making it suitable for use in environmentally conscious applications.
  • Moisture Sensitivity Level: With an MSL of 3 (168 hours), the SM671PAB-ADST offers a reasonable window for handling and assembly before soldering, reducing the risk of moisture-related defects.

SM671PAB-ADST Applications

The SM671PAB-ADST is well-suited for a variety of applications where high-density storage and fast data transfer are critical. Some specific use cases include:

  • Smartphones and Tablets: The high memory capacity and UFS3.1 interface make it ideal for mobile devices that require large storage and fast data access.
  • Embedded Systems: The compact 153-BGA package and surface mount compatibility are perfect for embedded systems with limited space.
  • Industrial Automation: The robustness and environmental compliance make it suitable for industrial applications where reliability and environmental standards are paramount.
  • Consumer Electronics: The SM671PAB-ADST can be used in various consumer electronics that require significant storage and fast performance, such as gaming consoles and digital cameras.

Conclusion of SM671PAB-ADST

The SM671PAB-ADST, despite being an obsolete product, offers several unique features and advantages that make it a valuable component for specific applications. Its 256Gbit memory size, UFS3.1 interface, and surface mount compatibility provide a high-performance solution for storage-intensive applications. The RoHS3 compliance and MSL rating ensure that it meets environmental standards and can be reliably integrated into modern designs. While the product is no longer in active production, its technical specifications and performance benefits make it a suitable choice for legacy systems and specialized applications where its features are still relevant.

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