Silicon Motion_SM671PED-BFST
original

Silicon Motion
SM671PED-BFST

774-SM671PED-BFST
PDF Datasheet
Ferri-UFS BGA 153-b eMMC 3D TLC
14 Weeks

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Tech Specifications

Operating Temperature
-40°C ~ 85°C
Memory Interface
UFS3.1
Memory Organization
128G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
153-BGA (11.5x13)
Series
Ferri-UFS ™
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SM671PED-BFST Description

SM671PED-BFST Description

The SM671PED-BFST is a high-performance memory IC chip designed by Silicon Motion, Inc., a leading provider of advanced semiconductor solutions. This chip is part of the Ferri-UFS series, featuring a BGA 153-ball package and utilizing 3D TLC NAND flash technology. It is designed to meet the demands of modern electronic devices that require high-speed data transfer and large storage capacities.

SM671PED-BFST Features

  • Memory Interface: The SM671PED-BFST supports the UFS3.1 interface, which is known for its high-speed data transfer capabilities. This interface ensures that the chip can handle large volumes of data quickly and efficiently, making it ideal for applications that require fast read/write speeds.
  • Memory Organization: The chip is organized as 128G x 8, providing a total memory size of 1Tbit. This large memory capacity is essential for devices that need to store significant amounts of data, such as high-resolution images, videos, and complex software applications.
  • Mounting Type: The SM671PED-BFST is designed for surface mount technology (SMT), which allows for compact and reliable integration into various electronic devices. This mounting method is preferred for its ability to reduce the overall footprint of the device while maintaining high performance.
  • Product Status: Currently, the SM671PED-BFST is in an active product status, ensuring that it is readily available for purchase and integration into new designs.
  • Package: The chip is available in bulk packaging, which is suitable for mass production and distribution. This packaging option helps to reduce costs and streamline the supply chain for manufacturers.
  • Memory Format: The SM671PED-BFST utilizes FLASH memory format, which is known for its non-volatile nature and ability to retain data even when power is not supplied. This feature is crucial for applications where data integrity is paramount.
  • RoHS Status: The chip is ROHS3 compliant, indicating that it meets the stringent environmental standards set by the Restriction of Hazardous Substances Directive. This compliance ensures that the product is safe for both the environment and end-users.
  • Moisture Sensitivity Level (MSL): The SM671PED-BFST has an MSL rating of 3 (168 hours), which means it can withstand exposure to moisture for up to 168 hours without degradation. This feature is important for applications in humid environments or during the manufacturing process.

SM671PED-BFST Applications

The SM671PED-BFST is ideal for a wide range of applications due to its high-speed data transfer capabilities and large memory capacity. Some specific use cases include:

  • Smartphones and Tablets: The UFS3.1 interface and large memory capacity make the SM671PED-BFST perfect for modern mobile devices that require fast data access and significant storage space for apps, media, and other content.
  • Digital Cameras and Camcorders: High-resolution imaging and video recording require fast write speeds and large storage capacities, which the SM671PED-BFST can provide.
  • Wearable Devices: The compact size and surface mount technology make it suitable for integration into wearable devices, where space is often limited.
  • Industrial and IoT Devices: The chip's reliability and environmental compliance make it a good fit for industrial and IoT applications where data integrity and durability are critical.

Conclusion of SM671PED-BFST

The SM671PED-BFST is a robust and versatile memory IC chip that offers significant advantages over similar models. Its UFS3.1 interface and large memory capacity ensure high-speed data transfer and ample storage, making it suitable for a variety of applications. The surface mount technology and compact design allow for easy integration into modern electronic devices, while its environmental compliance and moisture sensitivity level ensure durability and safety. Overall, the SM671PED-BFST is an excellent choice for manufacturers looking to incorporate high-performance memory solutions into their products.

FAQ

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The standard lead time for SM671PED-BFST is 14 Weeks.
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