Silicon Motion_SM671PXC-AFST
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Silicon Motion
SM671PXC-AFST

774-SM671PXC-AFST
IC FLASH 512GBIT UFS2.1 153BGA

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Tech Specifications

Operating Temperature
-25°C ~ 85°C
Memory Interface
UFS3.1
Memory Organization
64G x 8
Mounting Type
Surface Mount
Memory Type
Non-Volatile
Product Status
Active
Supplier Device Package
153-BGA (11.5x13)
Series
Ferri-UFS ™
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SM671PXC-AFST Description

SM671PXC-AFST Description

The SM671PXC-AFST is a high-performance Memory IC Chip designed by Silicon Motion, Inc. This IC FLASH 512GBIT UFS3.1 153BGA is engineered to deliver superior storage solutions for a variety of applications. With memory a organization of 64G x 8, it provides a substantial memory size of 512 Gbit, making it ideal for high-capacity storage needs. The SM671PXC-AFST is packaged in a surface mount format, ensuring it is suitable for modern, compact electronic designs. Its REACH Unaffected status and ROHS3 compliance make it a safe and environmentally friendly choice for manufacturers.

SM671PXC-AFST Features

  • Memory Interface: The SM671PXC-AFST utilizes the advanced UFS3.1 interface, offering high-speed data transfer rates and improved performance over previous generations.
  • Memory Organization: The 64G x 8 organization ensures efficient memory management and high-density storage capabilities.
  • Mounting Type: Surface Mount technology allows for seamless integration into compact and space-constrained designs.
  • Product: Status The SM671PXC-AFST is an active product, ensuring availability and support for ongoing projects.
  • Moisture Sensitivity Level (MSL): Rated at MSL 3 (168 Hours), this IC is designed to withstand typical manufacturing environments, reducing the risk of moisture-related damage.
  • Package: The Tray packaging method ensures the ICs are protected during shipping and handling, maintaining their integrity and reliability.
  • Memory Format: FLASH memory format provides non-volatile storage, ensuring data retention even when power is lost.

SM671PXC-AFST Applications

The SM671PXC-AFST is ideal for a wide range of applications that require high-capacity, high-speed storage solutions. Its advanced UFS3.1 interface and large memory size make it suitable for:

  • Smartphones and Tablets: Providing fast and reliable storage for mobile devices, enhancing user experience with quick app launches and seamless multimedia playback.
  • Embedded Systems: Ideal for embedded systems that require large amounts of non-volatile storage, such as industrial controllers and IoT devices.
  • Wearable Devices: Its compact size and high performance make it a perfect fit for wearable technology, ensuring data is stored and retrieved efficiently.
  • Automotive Infotainment Systems: The SM671PXC-AFST can be used in automotive applications where high-speed data access and large storage capacity are crucial for infotainment systems and advanced driver assistance systems (ADAS).

Conclusion of SM671PXC-AFST

The SM671PXC-AFST from Silicon Motion, Inc. stands out as a robust and reliable memory IC chip, offering significant advantages over similar models. Its high-speed UFS3.1 interface, large memory size, and compact surface mount design make it an excellent choice for a variety of applications. The REACH Unaffected and ROHS3 compliant status ensures it meets stringent environmental and safety standards. Whether used in smartphones, embedded systems, wearable devices, or automotive applications, the SM671PXC-AFST delivers high performance and reliability, making it a valuable component in modern electronic designs.

FAQ

What operating temperature range does SM671PXC-AFST support?
SM671PXC-AFST has an operating temperature range of -25°C ~ 85°C.
What package or case is SM671PXC-AFST available in?
Is SM671PXC-AFST currently in stock?
Are there related or alternative parts for SM671PXC-AFST?
What voltage specification is listed for SM671PXC-AFST?
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