STMicroelectronics_VND830PEP-E
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STMicroelectronics
VND830PEP-E

726-VND830PEP-E
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IC PWR DRVR N-CHAN 1:1 PWRSSO24

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Tech Specifications

Fault Protection
Over Voltage, Over Temperature
Interface
On/Off
Max Operating Temperature
150°C
Min Operating Temperature
-40°C
Max Output Current
6A
Max Power Dissipation
54W
Max Supply Current
7mA
Max Supply Voltage
36V
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VND830PEP-E Description

VND830PEP-E Description

The VND830PEP-E is a high-performance power management IC designed by STMicroelectronics, a leading manufacturer in the electronics industry. This device is part of the VIPower™ series and is specifically engineered for general-purpose applications requiring robust power handling capabilities. The VND830PEP-E features a high-side output configuration, making it ideal for applications where the load is connected between the power supply and the output of the driver. With a maximum output current of 6A and a load voltage range of 5.5V to 36V, this IC is well-suited for a variety of power management tasks.

The VND830PEP-E is designed to operate without a supply voltage (Vcc/Vdd), simplifying the power supply design. It offers a low Rds(on) of 60mOhm (max), ensuring high efficiency and minimal power loss. The device is housed in a surface-mount package, specifically a PWRSSO24, which is ideal for compact and space-constrained applications. The VND830PEP-E also includes comprehensive fault protection features such as fixed current limiting, open load detection, over-temperature protection, and over-voltage protection, ensuring reliable operation under various operating conditions.

VND830PEP-E Features

  • High-Side Output Configuration: Ideal for applications where the load is connected between the power supply and the output.
  • Maximum Output Current: Capable of delivering up to 6A, making it suitable for high-power applications.
  • Wide Load Voltage Range: Operates efficiently within a voltage range of 5.5V to 36V.
  • Low Rds(on): 60mOhm (max) ensures minimal power loss and high efficiency.
  • Comprehensive Fault Protection: Features fixed current limiting, open load detection, over-temperature protection, and over-voltage protection for reliable operation.
  • Surface-Mount Package: PWRSSO24 package is ideal for compact and space-constrained applications.
  • Auto Restart Feature: Enhances system reliability by automatically restarting the device after a fault condition is cleared.
  • RoHS3 Compliant and REACH Unaffected: Ensures compliance with environmental regulations and standards.
  • Moisture Sensitivity Level (MSL): MSL 1 (Unlimited) ensures the device is suitable for a wide range of environmental conditions.
  • General-Purpose Switch Type: Versatile and suitable for a variety of applications requiring robust power handling.

VND830PEP-E Applications

The VND830PEP-E is ideal for a wide range of applications due to its robust performance and versatile features. Some specific use cases include:

  • Automotive Applications: Ideal for power management in automotive systems where high reliability and fault protection are crucial.
  • Industrial Control: Suitable for industrial applications requiring high current handling and robust fault protection.
  • Power Supplies: Can be used in power supply designs where a high-side switch is required.
  • Motor Control: Effective in motor control applications where precise current control and protection are necessary.
  • Consumer Electronics: Ideal for consumer electronics requiring high power handling and compact design.

Conclusion of VND830PEP-E

The VND830PEP-E by STMicroelectronics stands out as a reliable and high-performance power management IC. Its high-side output configuration, wide load voltage range, and low Rds(on) make it an excellent choice for applications requiring robust power handling. The comprehensive fault protection features ensure reliable operation under various conditions, making it a preferred choice for automotive, industrial, and consumer electronics applications. The VND830PEP-E's compliance with environmental regulations and its versatile surface-mount package further enhance its suitability for modern electronic designs.

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