Texas Instruments

CD74AC05E  

Gates and Inverters

CD74AC05E Description

The CD74AC05E is a high-performance inverter logic IC chip designed for a variety of digital applications. Manufactured by Texas Instruments, this chip is part of the 74AC series, known for its robust performance and reliability. The CD74AC05E features six independent inverters, each with a single input, making it ideal for applications requiring multiple inversion functions.

Key technical specifications include a maximum propagation delay of 8.2ns at 5V with a 50pF load, ensuring fast signal processing and minimal latency. The chip operates within a supply voltage range of 1.5V to 5.5V, providing flexibility for various power supply configurations. Input logic levels are defined as 0.3V to 1.65V for low and 1.2V to 3.85V for high, allowing compatibility with a wide range of digital systems.

The CD74AC05E is housed in a through-hole package, specifically a 14-pin DIP (Dual In-line Package), which is suitable for both prototyping and production environments. The open-drain feature of the outputs allows for versatile interfacing with other digital circuits. Additionally, the chip is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and regulatory standards.

CD74AC05E Features

• High-Speed Performance: With a maximum propagation delay of 8.2ns at 5V and 50pF, the CD74AC05E ensures rapid signal inversion, making it suitable for high-speed digital systems.
• Wide Operating Voltage Range: The chip operates reliably within a supply voltage range of 1.5V to 5.5V, providing flexibility for different power supply requirements.
• Open-Drain Outputs: The open-drain feature allows for versatile interfacing with other digital circuits, enabling the use of pull-up resistors to achieve different logic levels.
• Robust Logic Levels: Input logic levels of 0.3V to 1.65V for low and 1.2V to 3.85V for high ensure compatibility with a wide range of digital systems.
• Environmental Compliance: The CD74AC05E is REACH unaffected and RoHS3 compliant, ensuring it meets environmental and regulatory standards.
• Low Quiescent Current: With a maximum quiescent current of 4 µA, the chip is energy-efficient, making it suitable for low-power applications.
• Through-Hole Packaging: The 14-pin DIP package is suitable for both prototyping and production environments, offering ease of use and integration.

CD74AC05E Applications

The CD74AC05E is ideal for a variety of applications requiring high-speed signal inversion and processing. Its robust performance and wide operating voltage range make it suitable for:

• Digital Signal Processing: Inverting digital signals in high-speed communication systems and data processing applications.
• Microcontroller Interfaces: Providing inversion functions for interfacing with microcontrollers and other digital devices.
• Digital Circuits: Enhancing the functionality of digital circuits by providing multiple inversion channels.
• Automotive Electronics: Utilizing its robust performance and wide operating voltage range in automotive applications.
• Industrial Control Systems: Implementing inversion functions in industrial control systems where reliability and speed are critical.

Conclusion of CD74AC05E

The CD74AC05E is a versatile and high-performance inverter logic IC chip that offers significant advantages over similar models. Its fast propagation delay, wide operating voltage range, and open-drain outputs make it suitable for a variety of high-speed digital applications. The chip's environmental compliance and low quiescent current further enhance its appeal for modern digital systems. Whether used in digital signal processing, microcontroller interfaces, or industrial control systems, the CD74AC05E provides reliable and efficient performance, making it an excellent choice for engineers and designers in the electronics industry.

CD74AC05E Documents

Download datasheets and manufacturer documentation for CD74AC05E

Datasheets :

CD54,74AC05      

HTML Datasheet :

CD54,74AC05      

PCN Design/Specification :

Copper Bond Wire Revision A 04/Dec/2013       Material Set 30/Mar/2017