Texas Instruments_X66AK2H06AAAW2

Texas Instruments
X66AK2H06AAAW2  
DSP

Texas Instruments
X66AK2H06AAAW2
698-X66AK2H06AAAW2
Ersa
Texas Instruments-X66AK2H06AAAW2-datasheets-2592095.pdf
IC DSP ARM SOC BGA
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X66AK2H06AAAW2 Description

X66AK2H06AAAW2 Description

The X66AK2H06AAAW2 is a high-performance, multicore embedded IC chip designed for demanding applications requiring both digital signal processing (DSP) and ARM® processing capabilities. Manufactured by Texas Instruments, this chip belongs to the 66AK2Hx KeyStone Multicore series, known for its robust architecture and versatile functionality.

This IC features a clock rate of 1.2GHz, ensuring rapid processing speeds and efficient handling of complex tasks. It integrates a DSP+ARM® architecture, combining the strengths of both processing types to offer a comprehensive solution for embedded systems. The X66AK2H06AAAW2 is equipped with 384kB of non-volatile ROM memory and 8.375MB of on-chip RAM, providing ample storage for firmware and data processing needs.

The chip operates within a temperature range of 0°C to 85°C, making it suitable for a wide range of environments. It supports various I/O voltages, including 0.85V, 1.0V, 1.35V, 1.5V, 1.8V, and 3.3V, offering flexibility in system design. The core voltage is variable, allowing for optimization based on specific application requirements.

The X66AK2H06AAAW2 is designed for surface mount technology, ensuring ease of integration into modern PCB designs. It is packaged in a tray format, facilitating efficient handling and storage. The chip's interfaces include EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, and USB 3.0, providing extensive connectivity options for various peripherals and networks.

X66AK2H06AAAW2 Features

The X66AK2H06AAAW2 offers several unique features that set it apart from similar models:

  • High Clock Rate: The 1.2GHz clock rate ensures fast processing speeds, making it ideal for real-time applications.
  • Multicore Architecture: The combination of DSP and ARM® cores provides a versatile processing platform capable of handling both signal processing and general-purpose computing tasks.
  • Robust Memory Configuration: With 384kB of ROM and 8.375MB of on-chip RAM, the chip can store and process large amounts of data efficiently.
  • Flexible I/O Voltages: Support for multiple I/O voltages allows for compatibility with a wide range of peripheral devices.
  • Extensive Connectivity: The inclusion of interfaces such as Ethernet, USB 3.0, and Serial RapidIO enables seamless integration into complex systems.
  • Surface Mount Compatibility: The surface mount mounting type ensures ease of integration into modern PCB designs.
  • Wide Operating Temperature Range: The 0°C to 85°C operating temperature range makes the chip suitable for various environmental conditions.
  • Compliance and Safety: The X66AK2H06AAAW2 is REACH unaffected and has a moisture sensitivity level (MSL) of 3 (168 hours), ensuring compliance with industry standards and reliability in humid environments.

X66AK2H06AAAW2 Applications

The X66AK2H06AAAW2 is ideal for a variety of applications, including:

  • Industrial Automation: The chip's high processing speed and extensive connectivity options make it suitable for controlling and monitoring industrial processes.
  • Telecommunications: The inclusion of Ethernet and USB 3.0 interfaces allows for efficient data transmission and network management.
  • Automotive Systems: The wide operating temperature range and robust architecture make it suitable for automotive applications, where reliability and performance are critical.
  • Medical Devices: The chip's ability to handle complex signal processing tasks makes it ideal for medical imaging and diagnostic equipment.
  • Consumer Electronics: The versatile processing capabilities and extensive connectivity options make it suitable for a wide range of consumer electronics applications.

Conclusion of X66AK2H06AAAW2

The X66AK2H06AAAW2 is a powerful and versatile embedded IC chip that offers a comprehensive solution for applications requiring both DSP and ARM® processing capabilities. Its high clock rate, robust memory configuration, and extensive connectivity options make it a standout choice in the electronics industry. The chip's flexibility in I/O voltages and wide operating temperature range further enhance its suitability for a variety of applications. Whether used in industrial automation, telecommunications, automotive systems, medical devices, or consumer electronics, the X66AK2H06AAAW2 delivers reliable performance and advanced functionality.

Tech Specifications

Operating Temperature
Non-Volatile Memory
ECCN
Mounting Type
Product Status
Supplier Device Package
Series
Clock Rate
Type
Package / Case
REACH Status
Mfr
Voltage - Core
Voltage - I/O
HTSUS
Package
Interface
RoHS Status
On-Chip RAM
Base Product Number
Moisture Sensitivity Level (MSL)

X66AK2H06AAAW2 Documents

Download datasheets and manufacturer documentation for X66AK2H06AAAW2

Ersa 66AK2H06/12/14 Errata      
Ersa 66AK2H06,12,14 Datasheet      
Ersa 66AK2H06,12,14 Datasheet      

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