Texas Instruments_66AK2H06BAAWA24

Texas Instruments
66AK2H06BAAWA24  
DSP

Texas Instruments
66AK2H06BAAWA24
698-66AK2H06BAAWA24
Ersa
Texas Instruments-66AK2H06BAAWA24-datasheets-2114353.pdf
IC DSP ARM SOC 1517FCBGA
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66AK2H06BAAWA24 Description

66AK2H06BAAWA24 Description

The 66AK2H06BAAWA24 is a high-performance System on Chip (SoC) from Texas Instruments, featuring a combination of a 1.2GHz DSP and a 1.4GHz ARM® processor. This SoC is part of the 66AK2Hx KeyStone Multicore series, designed for demanding applications that require both high-speed processing and efficient data handling. The device is packaged in a Surface Mount format, making it suitable for compact and high-density designs. It is available in a Tray package, ensuring reliable handling and storage.

66AK2H06BAAWA24 Features

  • Dual-Core Architecture: The 66AK2H06BAAWA24 features a dual-core architecture, combining a 1.2GHz DSP with a 1.4GHz ARM® processor. This combination allows for efficient processing of complex algorithms and general-purpose tasks.
  • Non-Volatile Memory: Equipped with 384kB of ROM, this SoC provides a robust storage solution for critical firmware and boot code.
  • On-Chip RAM: With 8.375MB of on-chip RAM, the device offers ample memory for high-speed data processing and temporary storage, reducing the need for external memory in many applications.
  • Variable Core Voltage: The core voltage is variable, allowing for optimization of power consumption based on the specific requirements of the application.
  • Flexible I/O Voltage: The device supports multiple I/O voltage levels (0.85V, 1.0V, 1.35V, 1.5V, 1.8V, 3.3V), providing flexibility in system design and compatibility with various peripherals.
  • Comprehensive Interface Options: The 66AK2H06BAAWA24 offers a wide range of interfaces, including EBI/EMI, Ethernet, DMA, I2C, Serial RapidIO, SPI, UART/USART, and USB 3.0. This extensive connectivity makes it suitable for a variety of applications, from industrial automation to advanced communication systems.
  • Compliance and Reliability: The device is REACH unaffected and ROHS3 compliant, ensuring it meets the highest environmental and safety standards. It also has a Moisture Sensitivity Level (MSL) of 4 (72 Hours), making it suitable for use in various environmental conditions.

66AK2H06BAAWA24 Applications

The 66AK2H06BAAWA24 is ideal for applications that require high computational power and efficient data handling. Some specific use cases include:

  • Industrial Automation: The combination of a powerful DSP and ARM® processor makes it suitable for real-time control and data processing in industrial environments.
  • Advanced Communication Systems: The extensive interface options and high-speed processing capabilities make it ideal for applications such as 5G base stations, where high data throughput and low latency are critical.
  • Embedded Systems: The device's compact size and high performance make it suitable for embedded systems in various industries, including automotive, aerospace, and medical devices.
  • Signal Processing: The 1.2GHz DSP core is particularly well-suited for applications requiring complex signal processing, such as radar systems and audio processing.

Conclusion of 66AK2H06BAAWA24

The 66AK2H06BAAWA24 from Texas Instruments is a versatile and powerful SoC that offers a unique combination of high-speed processing and efficient data handling. Its dual-core architecture, extensive interface options, and compliance with industry standards make it a reliable choice for a wide range of applications. Whether used in industrial automation, advanced communication systems, or embedded devices, the 66AK2H06BAAWA24 provides the performance and flexibility needed to meet the demands of modern electronics.

Tech Specifications

Operating Temperature
Non-Volatile Memory
ECCN
Mounting Type
Product Status
Supplier Device Package
Series
Clock Rate
Type
Package / Case
REACH Status
Mfr
Voltage - Core
Voltage - I/O
HTSUS
Package
Interface
RoHS Status
On-Chip RAM
Base Product Number
Moisture Sensitivity Level (MSL)
Program Memory Type
PCB changed
HTS
PPAP
Data Bus Width (bit)
Device Core
SPI
Automotive
Minimum Operating Temperature (°C)
Maximum Operating Temperature (°C)
Supplier Package
Core Architecture
Package Height
Family Name
Maximum Operating Supply Voltage (V)
I2C
EU RoHS
Interface Type
USB
RAM Size
UART
I2S
Package Length
Supplier Temperature Grade
Numeric and Arithmetic Format
Standard Package Name
Pin Count
Mounting
CAN
USART
Device Input Clock Speed (MHz)
Lead Shape
Ethernet
Part Status
Number of I/Os
Program Memory Size
Typical Operating Supply Voltage (V)
Package Width
Programmability
Minimum Operating Supply Voltage (V)

66AK2H06BAAWA24 Documents

Download datasheets and manufacturer documentation for 66AK2H06BAAWA24

Ersa 66AK2Hyy Die Revision 9/Feb/2018      
Ersa 66AK2H06/12/14 Errata      
Ersa Wafer Bump Site 21/Mar/2016      
Ersa 66AK2H06,12,14 Datasheet      
Ersa 66AK2H06,12,14 Datasheet      

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