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MDP1405191AGE04

MDP1405191AGE04 Description

The MDP1405191AGE04 from Vishay Dale is a high-performance 24-resistor network designed for precision applications. Housed in a 14-pin DIP package with through-hole mounting, it features a compact footprint of 0.750" x 0.250" (19.05mm x 6.35mm) and a low-profile height of 0.155" (3.94mm). This dual terminator network offers resistances of 330Ω and 470Ω with a tight ±2% tolerance and a stable ±100ppm/°C temperature coefficient, ensuring reliable performance across varying environmental conditions. The 125mW power rating per element and ROHS3 compliance make it suitable for modern, eco-conscious designs.

MDP1405191AGE04 Features

• 24 resistors in a single 14-pin DIP package, optimizing board space.
• Dual terminator circuit for balanced signal termination in high-speed applications.
• ±2% tolerance and ±100ppm/°C TCR for precision and stability.
• 125mW power dissipation per resistor, ensuring durability under load.
• Through-hole mounting for robust mechanical connections.
• ROHS3 compliant and MSL 1 (unlimited) for ease of handling and environmental safety.
• Tube packaging for secure shipping and storage.

MDP1405191AGE04 Applications

This resistor network is ideal for:

• Signal termination in communication systems and high-speed digital circuits.
• Impedance matching in audio/video equipment and RF applications.
• Voltage division in industrial control systems and instrumentation.
• Pull-up/pull-down networks in microcontroller and FPGA designs.
• Automotive and aerospace electronics, where reliability and precision are critical.

Conclusion of MDP1405191AGE04

The MDP1405191AGE04 stands out for its high-density resistor integration, precision tolerances, and robust construction, making it a superior choice for demanding applications. Its dual terminator design and wide operating range cater to industries requiring stable, long-term performance. Whether for consumer electronics, industrial systems, or automotive solutions, this Vishay Dale network delivers efficiency and reliability in a compact form factor.