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Heat Sinks
(171 results)Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
 HSB23-232325Heat Sinks | CUI Devices | HEAT SINK, BGA, 23 X 23 X 25 MM | 612 | - | |
 HSS25-B20-P51Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 | In Stock | - | |
 HSS19-B20-NPHeat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 | 2445 | - | |
 HSS20-B20-NPHeat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 | 1885 | - | |
 HSE02-173213Heat Sinks | CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 | 2795 | - | |
 HSB30-373710Heat Sinks | CUI Devices | HEAT SINK, BGA, 37.4 X 37 X 10 M | 417 | - | |
 HSE01-193175PHeat Sinks | CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 | 2055 | - | |
 HSB27-434316Heat Sinks | CUI Devices | HEAT SINK, BGA, 43.1 X 43.1 X 16 | 979 | - | |
 HSB25-282810Heat Sinks | CUI Devices | HEAT SINK, BGA, 28.5 X 28.5 X 10 | 1077 | - | |
HSE01-193175Heat Sinks | CUI Devices | HEAT SINK, EXTRUSION, 19 X 31.5 | 1539 | - | |
 HSB26-343408Heat Sinks | CUI Devices | HEAT SINK, BGA, 33.5 X 33.5 X 8 | 805 | - | |
 HSE06-503045Heat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | 1022 | - | |
 HSE10-B20-NPHeat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | 2728 | - | |
 HSS24-B20-NPHeat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 | 2894 | - | |
 HSE04-251265-1Heat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | 2137 | - | |
HSE02-173213PHeat Sinks | CUI Devices | HEAT SINK, EXTRUSION, 17 X 31.9 | 2746 | - | |
 HSB24-252510Heat Sinks | CUI Devices | HEAT SINK, BGA,25 X 25 X 10 MM | 1252 | - | |
 HSS23-B20-NPHeat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 | 2521 | - | |
 HSE11-B20-NPHeat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | In Stock | - | |
 HSE09-755028Heat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | 969 | - | |
HSE04-251265-2Heat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | 1751 | - | |
 HSE07-753045Heat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | 970 | - | |
 HSS26-B20-P38Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-218/TO-2 | 2998 | - | |
 HSE12-B20-NPHeat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | 1969 | - | |
 HSE08-505028Heat Sinks | CUI Devices | HEAT SINK, EXTRUSION, TO-218/TO- | 100 | - |
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