Heat Sinks

(171 results)

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.

Part # Manufacturer Description Availability Pricing Quantity
CUI Devices_HSB15-404010

HSB15-404010

Heat Sinks
CUI Devices HEAT SINK, BGA, 40 X 40 X 10 MM
931
-
CUI Devices_HSB05-171711

HSB05-171711

Heat Sinks
CUI Devices HEAT SINK, BGA, 17 X 17 X 11.5 M
1865
-
CUI Devices_HSB08-212106

HSB08-212106

Heat Sinks
CUI Devices HEAT SINK, BGA, 21 X 21 X 6 MM
1566
-
CUI Devices_HSS11-B20-P38

HSS11-B20-P38

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 50.
2150
-
CUI Devices_HSS08-B18-CP

HSS08-B18-CP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218, 44.
984
-
CUI Devices_HSB01-080808

HSB01-080808

Heat Sinks
CUI Devices HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
1866
-
CUI Devices_HSS07-C20-P274

HSS07-C20-P274

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 21.
2297
-
CUI Devices_HSB18-232310

HSB18-232310

Heat Sinks
CUI Devices HEAT SINK, BGA, 23 X 23 X 10 MM
4703
-
CUI Devices_HSS13-B20-NP

HSS13-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 31
1198
-
CUI Devices_HSB03-121218

HSB03-121218

Heat Sinks
CUI Devices HEAT SINK, BGA, 12 X 12 X 18 MM
133
-
CUI Devices_HSB10-232306

HSB10-232306

Heat Sinks
CUI Devices HEAT SINK, BGA, 23 X 23 X 6 MM
In Stock
-
CUI Devices_HSB14-353518

HSB14-353518

Heat Sinks
CUI Devices HEAT SINK, BGA, 35 X 35 X 18 MM
816
-
CUI Devices_HSS14-B20-NP

HSS14-B20-NP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 19.
4992
-
CUI Devices_HSS03-B20-P318

HSS03-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 41.
1820
-
CUI Devices_HSB17-404025

HSB17-404025

Heat Sinks
CUI Devices HEAT SINK, BGA, 40 X 40 X 25 MM
281
-
CUI Devices_HSB21-454515

HSB21-454515

Heat Sinks
CUI Devices HEAT SINK, BGA, 45 X 45 X 15 MM
1032
-
CUI Devices_HSS01-B20-CP

HSS01-B20-CP

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 49.
1083
-
CUI Devices_HSS02-B20-P318

HSS02-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 23.
1436
-
CUI Devices_HSS04-B20-P318

HSS04-B20-P318

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 41.
1968
-
CUI Devices_HSS09-B20-P431

HSS09-B20-P431

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 29.
2605
-
CUI Devices_HSS05-C20-SMT-TR

HSS05-C20-SMT-TR

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-220, 12.
1130
-
CUI Devices_HSE05-171933

HSE05-171933

Heat Sinks
CUI Devices HEAT SINK, EXTRUSION, TO-218/TO-
1673
-
CUI Devices_HSS21-B20-P53

HSS21-B20-P53

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
In Stock
-
CUI Devices_HSS27-B20-P43

HSS27-B20-P43

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
2396
-
CUI Devices_HSS28-B20-P39

HSS28-B20-P39

Heat Sinks
CUI Devices HEAT SINK, STAMPING, TO-218/TO-2
In Stock
-