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Heat Sinks
(171 results)Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.
| Part # | Manufacturer | Description | Availability | Pricing | Quantity |
|---|---|---|---|---|---|
 HSE-B250-04HHeat Sinks | CUI Devices | Extruded Heat Sink, TO-220 | 776 | - | |
 HSE-B18254-035HHeat Sinks | CUI Devices | Extruded Heat Sink, TO-218 | 162 | - | |
 HSE-B20254-035HHeat Sinks | CUI Devices | Extruded Heat Sink, TO-220 | 215 | - | |
 HSE-B20254-056HHeat Sinks | CUI Devices | Extruded Heat Sink, TO-220 | 1317 | - | |
 HSE-B20254-035H-01Heat Sinks | CUI Devices | Extruded Heat Sink, TO-220 | 2 | - | |
 HSE-B20254-040HHeat Sinks | CUI Devices | Extruded Heat Sink, TO-220 | 3602 | - | |
HSE-B500-04HHeat Sinks | CUI Devices | Heat Sink Passive TO-220 Vertical Thru-Hole Aluminum 6063-T5 Black Anodized | In Stock | - | |
HSE-B630-04HHeat Sinks | CUI Devices | Heat Sink Passive TO-220 Vertical Thru-Hole Aluminum 6063-T5 Black Anodized | In Stock | - | |
 HSS15-B20-P40Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 23. | 4826 | - | |
 HSB13-303014Heat Sinks | CUI Devices | HEAT SINK, BGA, 30.7 X 30.7 X 14 | 390 | - | |
 HSB03-141406Heat Sinks | CUI Devices | HEAT SINK, BGA, 14 X 14 X 6 MM | 931 | - | |
 HSB09-212115Heat Sinks | CUI Devices | HEAT SINK, BGA, 21 X 21 X 15 MM | In Stock | - | |
 HSB16-404018Heat Sinks | CUI Devices | HEAT SINK, BGA, 40 X 40 X 18 MM | 1174 | - | |
 HSB12-272706Heat Sinks | CUI Devices | HEAT SINK, BGA, 27 X 27 X 6 MM | 1293 | - | |
 HSS06-C20-P32Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 27. | 358 | - | |
 HSB06-181810Heat Sinks | CUI Devices | HEAT SINK, BGA, 18 X 18 X 10 MM | 1980 | - | |
 HSB22-606010Heat Sinks | CUI Devices | HEAT SINK, BGA, 60 X 60 X 10 MM | In Stock | - | |
 HSB04-171706Heat Sinks | CUI Devices | HEAT SINK, BGA, 17 X 17 X 6 MM | 2207 | - | |
 HSB20-353525Heat Sinks | CUI Devices | HEAT SINK, BGA, 35 X 35 X 25 MM | 560 | - | |
 HSB11-252518Heat Sinks | CUI Devices | HEAT SINK, BGA, 25 X 25 X 18 MM | 203 | - | |
 HSB02-101007Heat Sinks | CUI Devices | HEAT SINK, BGA, 10 X 10 X 7 MM | 3079 | - | |
 HSB19-272718Heat Sinks | CUI Devices | HEAT SINK, BGA, 27 X 27 X 18 MM | 518 | - | |
 HSS10-B20-P40Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 29. | 1675 | - | |
 HSB07-202009Heat Sinks | CUI Devices | HEAT SINK, BGA, 20 X 20 X 9 MM | 3 | - | |
 HSS12-B20-P95Heat Sinks | CUI Devices | HEAT SINK, STAMPING, TO-220, 19 | In Stock | - |
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