AMD_XC3S1000-5FGG676C
original

AMD
XC3S1000-5FGG676C

696-XC3S1000-5FGG676C
IC FPGA 391 I/O 676FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
442368
Number of LABs/CLBs
1920
ECCN
3A991D
Number of I/O
391
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
676-FBGA (27x27)
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XC3S1000-5FGG676C Description

The XC3S1000-5FGG676C is an FPGA (Field-Programmable Gate Array) device manufactured by AMD (Advanced Micro Devices). It belongs to the Spartan-3 series of FPGAs, which are known for their low cost, low power consumption, and small form factor, making them suitable for a wide range of applications.

Description:

The XC3S1000-5FGG676C is a mid-range FPGA device that offers a good balance between performance, power consumption, and cost. It features a high-density architecture, which allows for the implementation of complex digital circuits and systems. The device is available in a 676-pin Fine-Pitch Ball Grid Array (FBGA) package, making it suitable for use in high-density applications.

Features:

  1. Low power consumption: The Spartan-3 series of FPGAs are designed to operate at low power levels, making them ideal for battery-powered or energy-sensitive applications.
  2. High-density architecture: The XC3S1000-5FGG676C offers a high-density architecture, allowing for the implementation of complex digital circuits and systems.
  3. Versatile I/O options: The device provides a wide range of I/O options, including differential I/O, LVDS, and high-speed transceivers, making it suitable for a variety of interface requirements.
  4. On-chip memory: The XC3S1000-5FGG676C includes on-chip memory resources, such as block RAM and distributed RAM, which can be used to implement various memory functions and improve system performance.
  5. Digital signal processing (DSP) capabilities: The device offers DSP blocks that can be used to implement various signal processing functions, such as filtering, Fourier transforms, and convolution.
  6. Security features: The XC3S1000-5FGG676C includes security features, such as encryption and authentication, to protect intellectual property and ensure data integrity.

Applications:

The XC3S1000-5FGG676C is suitable for a wide range of applications, including:

  1. Industrial control systems: The device's low power consumption and high-density architecture make it ideal for use in industrial control systems, where space and energy efficiency are critical.
  2. Communications systems: The versatile I/O options and high-speed transceivers make the XC3S1000-5FGG676C suitable for use in various communication systems, such as wireless base stations, routers, and switches.
  3. Automotive systems: The device's low power consumption and robustness make it suitable for use in automotive applications, such as engine control units, infotainment systems, and driver assistance systems.
  4. Consumer electronics: The XC3S1000-5FGG676C can be used in consumer electronics, such as smartphones, tablets, and smart home devices, to implement various digital functions and improve system performance.
  5. Security systems: The security features of the device make it suitable for use in security systems, such as encryption and authentication, to protect intellectual property and ensure data integrity.
  6. Aerospace and defense: The device's high-density architecture and digital signal processing capabilities make it suitable for use in aerospace and defense applications, such as radar systems, satellite communications, and electronic warfare systems.

FAQ

What package or case is XC3S1000-5FGG676C available in?
XC3S1000-5FGG676C is available in the 676-BGA package / case.
Are there related or alternative parts for XC3S1000-5FGG676C?
What is the mounting type of XC3S1000-5FGG676C?
What is XC3S1000-5FGG676C?
What operating temperature range does XC3S1000-5FGG676C support?
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