AMD
XC3S1500-5FGG676C

696-XC3S1500-5FGG676C
IC FPGA 487 I/O 676FBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
589824
Number of LABs/CLBs
3328
ECCN
3A991D
Number of I/O
487
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
676-FBGA (27x27)
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XC3S1500-5FGG676C Description

The XC3S1500-5FGG676C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Spartan-3A family of FPGAs, which are known for their low power consumption, high performance, and small form factor.

Description:

The XC3S1500-5FGG676C is a mid-range FPGA device that offers a balance of performance, power efficiency, and cost-effectiveness. It is designed for a wide range of applications, including embedded systems, communications, and consumer electronics.

Features:

  1. Low power consumption: The Spartan-3A family of FPGAs is designed to operate at low power levels, making it suitable for battery-powered and energy-sensitive applications.
  2. High performance: The XC3S1500-5FGG676C offers high-speed performance, with a maximum operating frequency of up to 500 MHz.
  3. Small form factor: The device is available in a compact 676-ball fine pitch ball grid array (FBGA) package, making it ideal for space-constrained applications.
  4. Versatile I/O options: The XC3S1500-5FGG676C provides a wide range of I/O options, including LVCMOS, LVDS, and SSTL, allowing for easy integration with various peripherals and interfaces.
  5. On-chip memory: The device includes block RAM (RAMB4) and distributed RAM, providing ample memory resources for data storage and processing.
  6. Digital signal processing (DSP) capabilities: The XC3S1500-5FGG676C features dedicated DSP slices, which can be used for high-speed mathematical operations and signal processing tasks.
  7. Security features: The device includes security features such as bitstream encryption and user-controlled configuration access, ensuring the protection of intellectual property and system integrity.

Applications:

The XC3S1500-5FGG676C is suitable for a wide range of applications, including:

  1. Embedded systems: The low power consumption and small form factor make it ideal for use in embedded systems, such as industrial control systems, medical devices, and automotive electronics.
  2. Communications: The high-speed performance and versatile I/O options make the XC3S1500-5FGG676C suitable for communication systems, such as network infrastructure, wireless base stations, and satellite communication equipment.
  3. Consumer electronics: The device can be used in various consumer electronics applications, such as set-top boxes, gaming consoles, and smart home devices.
  4. Image and video processing: The DSP capabilities and on-chip memory resources make the XC3S1500-5FGG676C suitable for image and video processing applications, such as surveillance systems, image recognition, and video encoding/decoding.
  5. Military and aerospace: The device's reliability and security features make it suitable for use in military and aerospace applications, such as radar systems, navigation equipment, and communication systems.

In summary, the AMD XC3S1500-5FGG676C is a versatile and powerful FPGA device that offers a balance of performance, power efficiency, and cost-effectiveness. Its wide range of features and applications make it suitable for various industries and applications, including embedded systems, communications, consumer electronics, and more.

FAQ

What package or case is XC3S1500-5FGG676C available in?
XC3S1500-5FGG676C is available in the 676-BGA package / case.
What operating temperature range does XC3S1500-5FGG676C support?
What voltage specification is listed for XC3S1500-5FGG676C?
What is the mounting type of XC3S1500-5FGG676C?
Are there related or alternative parts for XC3S1500-5FGG676C?
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