AMD_XC3S1000-5FTG256C
original

AMD
XC3S1000-5FTG256C

696-XC3S1000-5FTG256C
IC FPGA 173 I/O 256FTBGA

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
442368
Number of LABs/CLBs
1920
ECCN
3A001A7B
Number of I/O
173
Mounting Type
Surface Mount
Product Status
Last Time Buy
Supplier Device Package
256-FTBGA (17x17)
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XC3S1000-5FTG256C Description

The XC3S1000-5FTG256C is a field programmable gate array (FPGA) device manufactured by Advanced Micro Devices (AMD). This device is part of the Spartan-3 family of FPGAs, which are designed for a wide range of applications, including embedded systems, digital signal processing, and communication systems.

Description:

The XC3S1000-5FTG256C is a mid-range FPGA that offers a balance of performance, power efficiency, and cost-effectiveness. It is available in a 256-ball fine pitch ball grid array (FBGA) package, making it suitable for high-density applications and easy integration into complex systems.

Features:

  1. Logic capacity: The XC3S1000-5FTG256C features a logic capacity of approximately 1000 logic cells, making it suitable for a wide range of applications that require moderate logic density.
  2. I/O count: This device provides a total of 240 I/O (input/output) pins, offering flexibility in terms of interfacing with other components and systems.
  3. Performance: The XC3S1000-5FTG256C operates at a maximum frequency of 333 MHz, providing sufficient performance for many applications.
  4. Power consumption: This FPGA is designed to be power-efficient, making it suitable for battery-powered or energy-sensitive applications.
  5. Configuration memory: The device features 2 Mbit of configuration memory, allowing for flexible and customizable programming.
  6. On-chip memory: The XC3S1000-5FTG256C includes 144 Kbits of block RAM, which can be used for data storage and processing tasks.
  7. DSP blocks: This FPGA includes dedicated digital signal processing (DSP) blocks, making it suitable for applications that require advanced signal processing capabilities.

Applications:

The XC3S1000-5FTG256C is suitable for a wide range of applications, including but not limited to:

  1. Embedded systems: The XC3S1000-5FTG256C can be used in embedded systems for control, processing, and interfacing tasks.
  2. Digital signal processing: The on-chip DSP blocks make this FPGA suitable for applications that require advanced signal processing, such as audio processing, image processing, and communication systems.
  3. Communication systems: The XC3S1000-5FTG256C can be used in communication systems for tasks such as data encoding, decoding, and modulation/demodulation.
  4. Industrial control: This FPGA can be used in industrial control systems for tasks such as motor control, sensor interfacing, and data acquisition.
  5. Automotive systems: The XC3S1000-5FTG256C can be used in automotive systems for applications such as infotainment, telematics, and advanced driver assistance systems (ADAS).
  6. Networking equipment: This FPGA can be used in networking equipment for tasks such as packet processing, routing, and switching.

In summary, the AMD XC3S1000-5FTG256C is a versatile and powerful FPGA that offers a balance of performance, power efficiency, and cost-effectiveness. Its wide range of features and applications make it suitable for a variety of industries and applications, from embedded systems to communication and signal processing.

FAQ

What operating temperature range does XC3S1000-5FTG256C support?
XC3S1000-5FTG256C has an operating temperature range of 0°C ~ 85°C (TJ).
What package or case is XC3S1000-5FTG256C available in?
Does XC3S1000-5FTG256C have quantity-based pricing?
What is the mounting type of XC3S1000-5FTG256C?
What is XC3S1000-5FTG256C?
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