This electronic component is a integrated circuit. The component is packaged on a tray and has a standard package size of 1. It has 285 input/output pins and is surface-mount device (SMD) mounted. With 16825 LABs/CLBs and 215360 logic elements/cells, the component is both strong and adaptable. It has a total RAM size of 13455360 bits and runs on a 0.95V to 1.05V power supply. The component comes in a 484-BBGA, FCBGA package/case, and a 484-FCBGA (23x23) supplier device package. It can operate at temperatures ranging from 0°C to 100°C (TJ). The component is a dependable and effective option for a wide range of electrical applications.
36 Kb dual-port block RAM with built-in FIFO logic for on-chip data buffering.
High-performance SelectIO™ technology with support for DDR3 interfaces up to 1,866 Mb/s.
A user configurable analog interface (XADC), incorporating dual 12-bit 1MSPS analog-to-digital converters with on-chip thermal and supply sensors.
Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.
Quickly deploy embedded processing with MicroBlaze™ processor.
Internet of Things
Medical Equipment
Consumer Electronics
Aerospace & Defense
Download datasheets and manufacturer documentation for XC7A200T-3FBG484E