AMD_XC7S50-2FGGA484C
original

AMD
XC7S50-2FGGA484C

696-XC7S50-2FGGA484C
IC FPGA 250 I/O 484FBGA
16 Weeks

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Tech Specifications

Operating Temperature
0°C ~ 85°C (TJ)
Total RAM Bits
2764800
Number of LABs/CLBs
4075
ECCN
3A991D
Number of I/O
250
Mounting Type
Surface Mount
Product Status
Active
Supplier Device Package
484-FBGA (23x23)
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XC7S50-2FGGA484C Description

XC7S50-2FGGA484C Overview

250 I/Os allow data to be transported more efficiently. 52160 logic elements/cells make up logic blocks. A voltage source of 1V volts is required to run FPGA chips. This FPGA module can be connected to the development board through a Surface Mount connectora battery of 0.95V1.05V powers this device. FPGA chips are required to keep the operational temperature between 0°C and 85°C TJ when the device is turned on. Unlike previous FPGA variants, this one is confined within Tray to save space. It contains 484 terminations in all. It is worth noting that this device comes with 2764800 FPGA electronics s of RAM.

XC7S50-2FGGA484C Features

A user-configurable analogue interface (XADC), incorporating dual 12-bit 1MSPS analogue-to-digital converters with on-chip thermal and supply sensors.

Powerful clock management tiles (CMT), combining phase-locked loop (PLL) and mixed-mode clock manager (MMCM) blocks for high precision and low jitter.

Quickly deploy embedded processing with MicroBlazeprocessor.

XC7S50-2FGGA484C Applications

Wireless Communications

Voice recognition

Embedded Vision

Audio

Enterprise networking

FAQ

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Availability (In Stock : 266 )
Quantity Unit Price Ext. Price
1+ $30.91885 $30.92
30+ $29.58515 $887.55
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