AMD's XCKU3P-L1FFVB676I is a high-performance FPGA (Field-Programmable Gate Array) module that offers a range of features and applications for various industries.
Description:
The XCKU3P-L1FFVB676I is a versatile FPGA module that is based on the Xilinx Kintex UltraScale architecture. It is designed to provide high performance, low power consumption, and a wide range of I/O options for various applications. The module is available in a compact form factor and is suitable for use in a variety of environments.
Features:
High-performance FPGA: The XCKU3P-L1FFVB676I features a high-performance FPGA that can handle complex tasks and operations with ease.
Low power consumption: The module is designed to consume low power, making it suitable for use in energy-sensitive applications.
Wide range of I/O options: The XCKU3P-L1FFVB676I offers a wide range of I/O options, including high-speed transceivers, multi-gigabit transceivers, and I/O banks.
Compact form factor: The module is available in a compact form factor, making it suitable for use in space-constrained applications.
Versatile applications: The XCKU3P-L1FFVB676I can be used in a variety of applications, including aerospace and defense, industrial, medical, and telecommunications.
Applications:
Aerospace and defense: The XCKU3P-L1FFVB676I can be used in aerospace and defense applications, such as radar systems, satellite communications, and electronic warfare.
Industrial: The module can be used in industrial applications, such as motor control, machine vision, and robotics.
Medical: The XCKU3P-L1FFVB676I can be used in medical applications, such as imaging systems, patient monitoring, and medical instruments.
Telecommunications: The module can be used in telecommunications applications, such as network infrastructure, base stations, and optical networking.
In summary, the AMD XCKU3P-L1FFVB676I is a high-performance FPGA module that offers a range of features and applications for various industries. Its low power consumption, wide range of I/O options, and compact form factor make it an ideal choice for a variety of applications.
Tech Specifications
Operating Temperature
Total RAM Bits
Number of LABs/CLBs
ECCN
Number of I/O
Mounting Type
Product Status
Supplier Device Package
Series
Package / Case
Voltage - Supply
Mfr
HTSUS
Package
Number of Logic Elements/Cells
RoHS Status
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Number of Logic Elements
Number of Logic Array Blocks - LABs
Distributed RAM
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Supply Voltage - Min
Minimum Operating Temperature
Tradename
Embedded Block RAM - EBR
Data Rate
Moisture Sensitive
Operating Supply Voltage
Number of I/Os
Maximum Operating Temperature
Supply Voltage - Max
USHTS
Number of Transceivers
XCKU3P-L1FFVB676I Documents
Download datasheets and manufacturer documentation for XCKU3P-L1FFVB676I
Payment Methods include Prepayment TT (bank transfer), Western Union, and PayPal. Customers are responsible for shipping costs, bank charges, customs duties and taxes.
Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
Provide DHL, FedEx, UPS, EMS, SF Express and Registered Airmail International Delivery Service