AMD Tariff Inquiry

XCVC1802-2MLIVSVD1760

XCVC1802-2MLIVSVD1760 Description

The XCVC1802-2MLIVSVD1760 is a high-performance embedded IC chip from AMD's Versal™ AI Core series, designed to deliver exceptional processing capabilities and flexibility for a wide range of applications. This FPGA features a dual-core architecture, combining a 600MHz and a 1.4GHz processing speed, making it ideal for complex computational tasks. With 256KB of RAM and 1.5M logic cells, it offers robust memory and processing resources. The XCVC1802-2MLIVSVD1760 supports a comprehensive set of peripherals, including DDR, DMA, and PCIe, and boasts 692 I/Os, ensuring seamless integration with various hardware components.

XCVC1802-2MLIVSVD1760 Features

• Dual-Core Architecture: Combines a 600MHz and a 1.4GHz processor, providing versatile processing power.
• Robust Memory: Equipped with 256KB of RAM and 1.5M logic cells, ensuring efficient data handling and processing.
• Extensive Connectivity: Supports CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating diverse communication needs.
• High I/O Count: Features 692 I/Os, enabling extensive hardware interfacing.
• Advanced Peripherals: Includes DDR, DMA, and PCIe, enhancing data transfer and processing efficiency.
• Compliance and Packaging: ROHS3 compliant and available in a tray package, ensuring environmental standards and ease of handling.
• Moisture Sensitivity Level: MSL 4 (72 Hours), ensuring reliability in various environmental conditions.

XCVC1802-2MLIVSVD1760 Applications

The XCVC1802-2MLIVSVD1760 is well-suited for applications requiring high computational power and flexibility, such as:

• Artificial Intelligence and Machine Learning: Ideal for AI inference and machine learning tasks due to its high processing speed and logic cells.
• Industrial Automation: Its extensive connectivity and I/O capabilities make it perfect for controlling complex industrial systems.
• Telecommunications: Suitable for high-speed data processing and communication in telecom infrastructure.
• Automotive Systems: Can be used in advanced driver-assistance systems (ADAS) for real-time data processing and decision-making.
• Medical Devices: Provides the necessary processing power for medical imaging and diagnostic equipment.

Conclusion of XCVC1802-2MLIVSVD1760

The XCVC1802-2MLIVSVD1760 stands out in the market due to its dual-core architecture, extensive connectivity options, and robust memory. Its ability to handle complex tasks efficiently makes it a versatile solution for various industries. Whether used in AI applications, industrial automation, or telecommunications, this FPGA offers significant advantages over similar models, ensuring reliable performance and scalability. Its compliance with environmental standards and advanced packaging further enhance its appeal for modern electronics applications.