AMD_XCVC1902-1MSIVSVD1760
original

AMD
XCVC1902-1MSIVSVD1760

777-XCVC1902-1MSIVSVD1760
IC VERSAL AICORE FPGA 1760BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
600MHz, 1.3GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
3A001A7B
Number of I/O
692
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XCVC1902-1MSIVSVD1760 Description

XCVC1902-1MSIVSVD1760 Description

The XCVC1902-1MSIVSVD1760 is a high-performance System on Chip (SoC) from AMD, part of the Versal™ AI Core series. This IC is designed to deliver exceptional computational power and flexibility, making it suitable for a wide range of advanced applications. The device features a dual-speed architecture, capable of operating at 600MHz and 1.3GHz, ensuring robust performance across various workloads. It integrates a powerful MPU and FPGA architecture, providing both high-speed processing and programmable logic capabilities. With 256KB of RAM and 1.9M logic cells, this SoC offers ample memory and logic resources to handle complex tasks efficiently. The XCVC1902-1MSIVSVD1760 also supports a comprehensive set of peripherals, including DDR, DMA, and PCIe, enhancing its connectivity and data handling capabilities. It features 692 I/O ports, enabling extensive interfacing options. The product is classified under ECCN 3A001A7B and HTSUS 8542.39.0001, ensuring compliance with international trade regulations. It is packaged in a tray format and is ROHS3 compliant, making it environmentally friendly. The moisture sensitivity level (MSL) is rated at 4 (72 hours), ensuring reliability in various environmental conditions.

XCVC1902-1MSIVSVD1760 Features

The XCVC1902-1MSIVSVD1760 boasts several unique features that set it apart from similar models. Its dual-speed architecture allows for dynamic performance adjustments, making it ideal for applications requiring both high-speed processing and energy efficiency. The integration of MPU and FPGA architectures provides a versatile platform that can be customized to meet specific application requirements. The 256KB of RAM and 1.9M logic cells offer significant memory and logic resources, enabling the execution of complex algorithms and data-intensive tasks. The extensive set of peripherals, including DDR, DMA, and PCIe, ensures seamless connectivity and efficient data transfer. The 692 I/O ports provide ample interfacing options, making it suitable for applications requiring extensive connectivity. The device also supports a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, further enhancing its versatility. The product is actively supported by AMD, ensuring ongoing updates and technical support.

XCVC1902-1MSIVSVD1760 Applications

The XCVC1902-1MSIVSVD1760 is ideal for a variety of high-performance applications, particularly those requiring advanced processing capabilities and extensive connectivity. It is well-suited for applications in the fields of artificial intelligence, machine learning, and data analytics, where its powerful MPU and FPGA architecture can accelerate complex computations. The device's extensive I/O and connectivity options make it suitable for industrial automation, where it can interface with various sensors and control systems. It is also ideal for telecommunications infrastructure, where its high-speed processing and data handling capabilities can support advanced networking functions. The XCVC1902-1MSIVSVD1760's flexibility and programmability make it a valuable component in embedded systems, where it can be customized to meet specific application requirements. Additionally, its compliance with international trade regulations and environmental standards ensures its suitability for global deployment.

Conclusion of XCVC1902-1MSIVSVD1760

In conclusion, the XCVC1902-1MSIVSVD1760 is a highly versatile and powerful System on Chip (SoC) from AMD, designed to meet the demands of advanced applications. Its dual-speed architecture, MPU and FPGA integration, and extensive memory and logic resources provide a robust platform for high-performance computing. The comprehensive set of peripherals and connectivity options ensure seamless integration into various systems. The device's compliance with international trade regulations and environmental standards further enhance its appeal. Whether used in artificial intelligence, industrial automation, or telecommunications, the XCVC1902-1MSIVSVD1760 offers a reliable and efficient solution, making it a standout choice in the electronics industry.

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