AMD

XCVC1902-2LLIVSVD1760

XCVC1902-2LLIVSVD1760 Description

The XCVC1902-2LLIVSVD1760 is a high-performance embedded IC chip developed by AMD, part of the Versal™ AI Core series. This FPGA (Field-Programmable Gate Array) is designed to deliver exceptional processing capabilities, making it ideal for a wide range of applications requiring advanced computational power and flexibility. The XCVC1902-2LLIVSVD1760 features a dual-core architecture, combining a 450MHz MPU (MicroProcessing Unit) with a 1.08GHz FPGA fabric, providing a versatile platform for both general-purpose computing and highly parallelized tasks.

XCVC1902-2LLIVSVD1760 Features

• High-Speed Processing: The XCVC1902-2LLIVSVD1760 offers a dual-core architecture with a 450MHz MPU and a 1.08GHz FPGA, enabling it to handle complex computations and data processing tasks efficiently.
• Substantial RAM Capacity: Equipped with 256KB of RAM, this FPGA can manage large datasets and complex algorithms, ensuring smooth operation even under demanding conditions.
• Extensive I/O Capabilities: With 726 I/O pins, the XCVC1902-2LLIVSVD1760 provides ample connectivity options, making it suitable for applications requiring extensive peripheral interfacing.
• Advanced Peripherals: The FPGA supports a range of peripherals, including DDR memory, DMA (Direct Memory Access), and PCIe (Peripheral Component Interconnect Express), enhancing its versatility and integration capabilities.
• Robust Connectivity Options: The XCVC1902-2LLIVSVD1760 features a comprehensive suite of connectivity options, including CANbus, EBI/EMI (External Bus Interface/External Memory Interface), Ethernet, I2C, MMC/SD/SDIO (MultiMediaCard/Secure Digital/Secure Digital Input Output), SPI, UART/USART (Universal Asynchronous Receiver/Transmitter/Universal Synchronous/Asynchronous Receiver/Transmitter), and USB OTG (On-The-Go).
• Compliance and Packaging: The XCVC1902-2LLIVSVD1760 is packaged in a tray format and is ROHS3 compliant, ensuring environmental sustainability and regulatory adherence. It also has a Moisture Sensitivity Level (MSL) of 4 (72 Hours), making it suitable for various manufacturing processes.
• Active Product Status: As an active product, the XCVC1902-2LLIVSVD1760 benefits from ongoing support and updates, ensuring long-term reliability and compatibility.

XCVC1902-2LLIVSVD1760 Applications

The XCVC1902-2LLIVSVD1760 is well-suited for applications that demand high computational power, flexibility, and extensive connectivity. Some specific use cases include:

• AI and Machine Learning: The FPGA's architecture and processing capabilities make it ideal for implementing AI algorithms and machine learning models, enabling real-time data processing and decision-making.
• Advanced Networking: With its robust connectivity options, the XCVC1902-2LLIVSVD1760 can be used in networking equipment, such as routers and switches, to handle high-speed data transmission and complex network protocols.
• Industrial Automation: The extensive I/O capabilities and peripheral support make this FPGA suitable for industrial control systems, where it can interface with various sensors, actuators, and communication protocols.
• Embedded Systems: The XCVC1902-2LLIVSVD1760 can serve as the core component in embedded systems, providing the necessary processing power and flexibility for applications ranging from consumer electronics to automotive systems.

Conclusion of XCVC1902-2LLIVSVD1760

The XCVC1902-2LLIVSVD1760 is a powerful and versatile FPGA from AMD's Versal™ AI Core series, offering a combination of high-speed processing, substantial RAM, and extensive connectivity options. Its dual-core architecture and 1.9M logic cells provide unparalleled computational capabilities, making it suitable for a wide range of applications, from AI and machine learning to industrial automation and advanced networking. With its active product status and ROHS3 compliance, the XCVC1902-2LLIVSVD1760 is a reliable choice for developers and engineers looking to integrate a high-performance FPGA into their projects.