AMD

XCVC1902-2MLIVSVD1760  

System On Chip (SoC)

XCVC1902-2MLIVSVD1760 Description

The XCVC1902-2MLIVSVD1760 is a high-performance Versal™ AI Core FPGA designed by AMD, offering a powerful combination of processing capabilities and extensive connectivity options. This embedded IC chip is part of the Versal™ AI Core series, known for its advanced architecture and robust performance. The XCVC1902-2MLIVSVD1760 features dual-speed capabilities, operating at 600MHz and 1.4GHz, providing flexibility and efficiency for various applications. It integrates a microprocessor unit (MPU) and FPGA architecture, making it suitable for complex computing tasks and programmable logic applications.

XCVC1902-2MLIVSVD1760 Features

• Dual-Speed Performance: The XCVC1902-2MLIVSVD1760 operates at speeds of 600MHz and 1.4GHz, offering versatile performance options for different operational requirements.
• Advanced Architecture: It combines MPU and FPGA capabilities, providing both high-level processing and programmable logic functionalities.
• Substantial RAM: Equipped with 256KB of RAM, this FPGA can handle significant data storage and processing tasks efficiently.
• Extensive Connectivity: The XCVC1902-2MLIVSVD1760 supports a wide range of peripherals, including DDR, DMA, PCIe, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly versatile for various applications.
• Robust I/O Capabilities: With 692 I/Os, it can manage multiple inputs and outputs simultaneously, enhancing its adaptability for complex systems.
• Compliance and Packaging: The product is ROHS3 compliant and comes in a tray package, ensuring environmental standards and ease of handling.
• Moisture Sensitivity Level: MSL 4 (72 Hours) ensures reliability in various environmental conditions.
• Primary Attributes: As a Versal™ AI Core FPGA with 1.9M Logic Cells, it excels in high-density logic applications.

XCVC1902-2MLIVSVD1760 Applications

The XCVC1902-2MLIVSVD1760 is ideal for applications requiring high computational power and extensive connectivity. Its dual-speed performance and versatile architecture make it suitable for:

• AI and Machine Learning: The combination of MPU and FPGA capabilities allows for efficient processing of AI algorithms and machine learning tasks.
• Advanced Networking: With extensive connectivity options, including Ethernet and PCIe, it is well-suited for high-speed networking applications.
• Industrial Automation: The robust I/O capabilities and connectivity options make it ideal for controlling and managing complex industrial systems.
• Embedded Systems: Its compact design and high performance make it suitable for embedded systems in various industries, including automotive, aerospace, and telecommunications.

Conclusion of XCVC1902-2MLIVSVD1760

The XCVC1902-2MLIVSVD1760 stands out as a versatile and powerful solution in the embedded IC chips market. Its dual-speed performance, advanced architecture, and extensive connectivity options make it a standout choice for applications requiring high computational power and flexibility. With its compliance to environmental standards and robust I/O capabilities, the XCVC1902-2MLIVSVD1760 ensures reliability and adaptability in various industrial and commercial settings. Whether for AI and machine learning, advanced networking, industrial automation, or embedded systems, this FPGA offers a comprehensive solution that meets the demands of modern electronics.

XCVC1902-2MLIVSVD1760 Documents

Download datasheets and manufacturer documentation for XCVC1902-2MLIVSVD1760