AMD

XCVC1802-1LSIVSVD1760  

System On Chip (SoC)

XCVC1802-1LSIVSVD1760 Description

The XCVC1802-1LSIVSVD1760 is a high-performance Versal™ AI Core FPGA from AMD, designed to meet the demanding requirements of modern embedded systems. This IC is part of the Versal™ AI Core series, known for its advanced architecture and versatile capabilities. The XCVC1802-1LSIVSVD1760 features a dual-core ARM Cortex-A72 processor, providing a powerful processing capability with speeds up to 1GHz. It also includes a robust FPGA fabric with 1.5M logic cells, enabling complex and customizable logic designs. The device is packaged in a 1760 BGA package, offering a compact and efficient solution for space-constrained applications.

XCVC1802-1LSIVSVD1760 Features

Architecture

• MPU and FPGA: The XCVC1802-1LSIVSVD1760 combines a multi-processor unit (MPU) with a field-programmable gate array (FPGA), providing a versatile platform for both deterministic and flexible processing tasks.
• Speed: The device operates at speeds up to 400MHz and 1GHz, ensuring high-performance processing capabilities.
• RAM Size: Equipped with 256KB of RAM, the XCVC1802-1LSIVSVD1760 offers ample memory for efficient data handling and processing.
• I/O Capability: With 692 I/O pins, this FPGA provides extensive connectivity options, making it suitable for a wide range of applications.

Connectivity and Peripherals

• DDR, DMA, PCIe: The XCVC1802-1LSIVSVD1760 supports advanced peripherals such as DDR memory, DMA (Direct Memory Access), and PCIe (Peripheral Component Interconnect Express), enabling high-speed data transfer and efficient system integration.
• Connectivity: The device features a comprehensive suite of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it ideal for applications requiring multiple communication protocols.

Compliance and Packaging

• ECCN: The XCVC1802-1LSIVSVD1760 is classified under ECCN 3A001A7B, indicating its compliance with international export control regulations.
• Package: The device is available in a Tray package, ensuring reliable handling and storage.
• RoHS Status: The XCVC1802-1LSIVSVD1760 is ROHS3 compliant, meeting stringent environmental standards and ensuring the use of environmentally friendly materials.
• Moisture Sensitivity Level (MSL): With an MSL of 4 (72 Hours), the device is suitable for applications requiring moderate moisture protection.

XCVC1802-1LSIVSVD1760 Applications

The XCVC1802-1LSIVSVD1760 is ideal for a variety of applications, including:

• Advanced Networking: The device's high-speed processing and extensive connectivity options make it suitable for advanced networking applications, such as 5G infrastructure and high-speed data communication systems.
• AI and Machine Learning: The combination of a powerful MPU and FPGA fabric allows for efficient implementation of AI and machine learning algorithms, making it ideal for applications such as autonomous vehicles, industrial automation, and smart cities.
• Embedded Systems: The XCVC1802-1LSIVSVD1760's versatile architecture and extensive I/O capabilities make it an excellent choice for embedded systems requiring high performance and flexibility, such as aerospace and defense systems, medical devices, and IoT gateways.

Conclusion of XCVC1802-1LSIVSVD1760

The XCVC1802-1LSIVSVD1760 is a versatile and high-performance Versal™ AI Core FPGA from AMD, offering a powerful combination of MPU and FPGA capabilities. Its extensive connectivity options, high-speed processing, and compliance with environmental standards make it an ideal choice for a wide range of applications. Whether used in advanced networking, AI and machine learning, or embedded systems, the XCVC1802-1LSIVSVD1760 provides a reliable and efficient solution, ensuring optimal performance and flexibility.

XCVC1802-1LSIVSVD1760 Documents

Download datasheets and manufacturer documentation for XCVC1802-1LSIVSVD1760

Datasheets :

Versal AI Core Series       Versal® AI Core Product Selection Guide       Versal Overview