AMD_XCZU4EG-2SFVC784E

AMD
XCZU4EG-2SFVC784E  
System On Chip (SoC)

AMD
XCZU4EG-2SFVC784E
777-XCZU4EG-2SFVC784E
IC SOC CORTEX-A53 784FCBGA
In Stock : 3

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XCZU4EG-2SFVC784E Description

XCZU4EG-2SFVC784E Description

The XCZU4EG-2SFVC784E from AMD's Zynq® UltraScale+™ MPSoC EG series is a high-performance System-on-Chip (SoC) integrating a quad-core ARM® Cortex®-A53 processor (operating at 533MHz, 600MHz, or 1.3GHz) with a UltraScale+™ FPGA fabric featuring 192K+ logic cells. Packaged in a 784-pin FCBGA, this device combines programmable logic with processing power, making it ideal for compute-intensive embedded applications. It operates within a 0°C to 100°C (TJ) range and complies with ROHS3 and REACH environmental standards.

XCZU4EG-2SFVC784E Features

  • Heterogeneous Architecture: Combines MCU (Cortex-A53) and FPGA (UltraScale+) for flexible hardware-software co-design.
  • High-Speed Connectivity: Supports CANbus, Ethernet, USB OTG, I2C, SPI, UART/USART, and MMC/SD/SDIO for versatile interfacing.
  • Rich Peripherals: Includes DMA and WDT (Watchdog Timer) for robust system management.
  • Ample I/O: 252 I/O pins enable extensive external device integration.
  • Memory Resources: 256KB RAM for efficient data handling.
  • Industrial Robustness: MSL 4 (72 hours) moisture sensitivity and wide operating temperature range suit harsh environments.
  • Performance Scalability: Multiple speed grades (up to 1.3GHz) balance power and performance.

XCZU4EG-2SFVC784E Applications

  • Embedded Vision: Real-time image processing in medical imaging or automotive ADAS.
  • Industrial Automation: PLCs, motor control, and robotics leveraging FPGA flexibility.
  • Communications: High-speed data routing and packet processing in 5G infrastructure.
  • Aerospace & Defense: Secure, low-latency systems requiring radiation-tolerant design.
  • AI Edge Computing: Accelerating machine learning inference at the edge.

Conclusion of XCZU4EG-2SFVC784E

The XCZU4EG-2SFVC784E stands out for its dual ARM-FPGA architecture, high-speed interfaces, and industrial-grade reliability, offering a scalable solution for complex embedded systems. Its ability to merge real-time processing with programmable logic makes it superior to conventional MCUs or standalone FPGAs, particularly in applications demanding low latency, high throughput, and reconfigurability. Ideal for sectors like automotive, Industry 4.0, and telecom, this SoC delivers future-proof performance in a compact, power-efficient package.

Tech Specifications

Core Processor
Speed
Operating Temperature
Architecture
Flash Size
RAM Size
ECCN
Number of I/O
Peripherals
Product Status
Supplier Device Package
Series
Package / Case
REACH Status
Mfr
Connectivity
HTSUS
Package
RoHS Status
Primary Attributes
Base Product Number
Moisture Sensitivity Level (MSL)
Mounting Style
Number of Logic Elements
Number of Logic Array Blocks - LABs
Distributed RAM
L1 Cache Instruction Memory
Embedded Memory
Adaptive Logic Modules - ALMs
RoHS
Minimum Operating Temperature
Tradename
L1 Cache Data Memory
Embedded Block RAM - EBR
Moisture Sensitive
Operating Supply Voltage
Maximum Clock Frequency
Number of I/Os
Maximum Operating Temperature
USHTS
Number of Cores
Number of Transceivers
Core

XCZU4EG-2SFVC784E Documents

Download datasheets and manufacturer documentation for XCZU4EG-2SFVC784E

Ersa UltraScale Architecture and Product Data Sheet: Overview (PDF)      

Shopping Guide

Payment Methods
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Shipping Rate
Shipments are made once a day around 5pm, excluding Sundays. Once shipped, the estimated delivery time is usually 5-7 business days, depending on the courier you choose.
Delivery Methods
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