AMD_XCZU4EV-1FBVB900E
original

AMD
XCZU4EV-1FBVB900E

777-XCZU4EV-1FBVB900E
IC SOC CORTEX-A53 900FCBGA
16 Weeks

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Tech Specifications

Manufacturer
AMD
Series
Zynq® UltraScale+™ MPSOC EV
Packaging
Tray
Part Status
Active
Architecture
MCU, FPGA
Core Processor
Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
Flash Size
-
RAM Size
256KB
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XCZU4EV-1FBVB900E Description

XCZU4EV-1FBVB900E Description

The XCZU4EV-1FBVB900E is a high-performance System-on-Chip (SoC) from AMD's Zynq® UltraScale+™ MPSoC EV series, integrating a dual-core ARM® Cortex®-A53 processor (up to 1.2GHz) with a UltraScale+™ FPGA fabric (192K+ logic cells). Designed for demanding embedded applications, it operates within a 0°C to 100°C (TJ) range and features 256KB RAM, 204 I/O pins, and advanced peripherals like DMA, WDT, CANbus, Ethernet, USB OTG, and multiple serial interfaces (I2C, SPI, UART/USART). Packaged in a 900-ball FCBGA, it complies with ROHS3 and REACH standards, making it suitable for industrial and commercial use.

XCZU4EV-1FBVB900E Features

  • Heterogeneous Architecture: Combines FPGA programmability with ARM Cortex-A53 MCU for flexible, high-speed processing.
  • High-Speed Connectivity: Supports Ethernet, USB OTG, CANbus, and SD/SDIO for seamless data transfer.
  • Scalable Performance: Configurable clock speeds (500MHz, 600MHz, or 1.2GHz) optimize power vs. performance.
  • Robust I/O Capability: 204 I/O pins enable extensive interfacing with sensors, memory, and peripherals.
  • Industrial Reliability: MSL 4 (72 hours) and 100°C TJ rating ensure durability in harsh environments.
  • Low-Power FPGA Integration: UltraScale+™ technology reduces power consumption while delivering high logic density.

XCZU4EV-1FBVB900E Applications

  • Industrial Automation: Real-time control systems leveraging FPGA flexibility and ARM processing.
  • Aerospace & Defense: Secure, high-reliability embedded computing for avionics and radar.
  • Medical Imaging: High-throughput data processing for ultrasound or MRI systems.
  • Automotive ADAS: Sensor fusion and vision processing for autonomous driving.
  • Communications Infrastructure: 5G basebands and network accelerators.

Conclusion of XCZU4EV-1FBVB900E

The XCZU4EV-1FBVB900E stands out for its dual-core ARM + FPGA architecture, making it ideal for compute-intensive, low-latency applications. Its rich connectivity, industrial-grade robustness, and scalable performance offer a competitive edge over conventional SoCs. Whether for edge AI, motor control, or high-speed data acquisition, this SoC delivers a balanced blend of programmability and processing power.

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