AMD_XCVC1902-2MSIVSVD1760
original

AMD
XCVC1902-2MSIVSVD1760

777-XCVC1902-2MSIVSVD1760
IC VERSAL AICORE FPGA 1760BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
600MHz, 1.4GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
ECCN
3A001A7B
Number of I/O
692
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XCVC1902-2MSIVSVD1760 Description

XCVC1902-2MSIVSVD1760 Description

The XCVC1902-2MSIVSVD1760 is a high-performance embedded IC chip from AMD's Versal™ AI Core series, designed to deliver exceptional processing capabilities and flexibility for a wide range of applications. This FPGA features a dual-speed architecture, supporting 600MHz and 1.4GHz operation, which allows for optimized performance across various workloads. It is equipped with 256KB of RAM and 1.9M logic cells, providing ample resources for complex computations and data processing tasks.

The XCVC1902-2MSIVSVD1760 is built on a versatile architecture that combines a multi-processing unit (MPU) with FPGA capabilities, enabling it to handle both general-purpose processing and highly customized logic functions. It supports a robust set of peripherals, including DDR, DMA, and PCIe, which enhance its connectivity and data transfer capabilities. The chip also features extensive I/O capabilities, with 692 I/Os, and a wide range of connectivity options, such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it suitable for diverse embedded systems.

This product is classified under ECCN 3A001A7B and HTSUS 8542.39.0001, ensuring compliance with international export regulations. It is packaged in a tray format and is ROHS3 compliant, adhering to strict environmental standards. The XCVC1902-2MSIVSVD1760 has a moisture sensitivity level (MSL) of 4, allowing for a 72-hour exposure period, which is ideal for manufacturing processes that require flexibility in handling and assembly.

XCVC1902-2MSIVSVD1760 Features

The XCVC1902-2MSIVSVD1760 offers several unique features that set it apart from similar models:

  • Dual-Speed Architecture: The ability to operate at 600MHz and 1.4GHz provides flexibility in balancing power consumption and performance, making it suitable for both high-speed processing and energy-efficient applications.
  • Versatile Architecture: Combining MPU and FPGA capabilities, this chip can handle both general-purpose computing tasks and highly customized logic functions, offering a comprehensive solution for complex systems.
  • Extensive I/O and Connectivity: With 692 I/Os and a wide range of connectivity options, the XCVC1902-2MSIVSVD1760 can easily integrate with various peripherals and communication protocols, enhancing its versatility in embedded systems.
  • Comprehensive Peripherals Support: The inclusion of DDR, DMA, and PCIe peripherals ensures efficient data transfer and processing, making it ideal for applications requiring high-speed data handling.
  • Environmental Compliance: The ROHS3 compliance and MSL 4 rating ensure that the XCVC1902-2MSIVSVD1760 meets stringent environmental and manufacturing standards, making it suitable for a wide range of industries.

XCVC1902-2MSIVSVD1760 Applications

The XCVC1902-2MSIVSVD1760 is ideal for a variety of applications due to its high performance, flexibility, and extensive connectivity options. Some specific use cases include:

  • Advanced AI and Machine Learning Systems: The combination of MPU and FPGA capabilities allows for efficient processing of complex AI algorithms, making it suitable for applications such as autonomous vehicles, smart surveillance, and industrial automation.
  • High-Speed Data Processing: With its extensive I/O and connectivity options, the XCVC1902-2MSIVSVD1760 can handle large volumes of data, making it ideal for applications such as telecommunications, networking, and data centers.
  • Embedded Systems: The chip's versatility and compliance with environmental standards make it suitable for a wide range of embedded systems, including consumer electronics, medical devices, and industrial control systems.

Conclusion of XCVC1902-2MSIVSVD1760

The XCVC1902-2MSIVSVD1760 is a powerful and versatile embedded IC chip that offers significant advantages over similar models. Its dual-speed architecture, extensive I/O capabilities, and comprehensive peripheral support make it an ideal choice for applications requiring high performance and flexibility. The chip's compliance with environmental and manufacturing standards ensures its suitability for a wide range of industries. Whether used in advanced AI systems, high-speed data processing applications, or embedded systems, the XCVC1902-2MSIVSVD1760 provides a reliable and efficient solution for modern electronics.

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