AMD_XCVM1302-1LSEVFVC1596
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AMD
XCVM1302-1LSEVFVC1596

777-XCVM1302-1LSEVFVC1596
IC VERSALPRIME ACAP FPGA 1596BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
400MHz, 1GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
-
Number of I/O
532
Peripherals
DDR, DMA, PCIe
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XCVM1302-1LSEVFVC1596 Description

XCVM1302-1LSEVFVC1596 Description

The XCVM1302-1LSEVFVC1596 is a high-performance, multi-functional Embedded IC Chip from the Versal™ Prime series, manufactured by AMD. This advanced FPGA (Field-Programmable Gate Array) is designed to deliver exceptional performance and flexibility, making it suitable for a wide range of complex applications. The device operates within a temperature range of 0°C to 100°C (TJ) and supports multiple clock speeds, including 400MHz and 1GHz, ensuring it can handle demanding computational tasks efficiently. With 70k logic cells, it offers significant processing power and adaptability.

XCVM1302-1LSEVFVC1596 Features

  • Architecture: The XCVM1302-1LSEVFVC1596 combines the capabilities of a MPU (MicroProcessing Unit) and an FPGA, providing a versatile platform for both general-purpose computing and highly customized logic operations.
  • I/O and Connectivity: This IC chip boasts 532 I/Os and a comprehensive set of peripherals, including DDR, DMA, and PCIe, which facilitate seamless integration with various external devices and systems. Connectivity options like CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG further enhance its interoperability.
  • Performance: The dual-clock speed options of 400MHz and 1GHz ensure that the XCVM1302-1LSEVFVC1596 can meet the performance requirements of diverse applications, from high-speed data processing to real-time control systems.
  • Packaging and Compliance: The device is packaged in a Tray format and is ROHS3 compliant, adhering to stringent environmental standards. It also has a Moisture Sensitivity Level (MSL) of 4 (72 Hours), ensuring reliability in various environmental conditions.

XCVM1302-1LSEVFVC1596 Applications

The XCVM1302-1LSEVFVC1596 is ideal for applications that require high computational power, flexibility, and robust connectivity. Some specific use cases include:

  • Telecommunications: Ideal for base stations, signal processing, and network infrastructure where high-speed data handling and real-time processing are critical.
  • Industrial Automation: Suitable for programmable logic controllers (PLCs), robotics, and industrial IoT devices that demand reliable and efficient processing capabilities.
  • Data Centers: Can be used in server acceleration, data processing, and storage applications where performance and scalability are paramount.
  • Automotive: Perfect for advanced driver-assistance systems (ADAS) and infotainment systems that require high-speed data processing and low latency.

Conclusion of XCVM1302-1LSEVFVC1596

The XCVM1302-1LSEVFVC1596 from AMD's Versal™ Prime series is a powerful and versatile Embedded IC Chip that stands out for its exceptional performance, extensive connectivity options, and robust architecture. Its ability to operate at multiple clock speeds and its large number of logic cells make it a highly adaptable solution for a variety of demanding applications. The device's compliance with environmental standards and its reliable packaging further enhance its appeal. Whether for telecommunications, industrial automation, data centers, or automotive applications, the XCVM1302-1LSEVFVC1596 offers a compelling combination of features and benefits that position it as a leading choice in the FPGA market.

FAQ

What operating temperature range does XCVM1302-1LSEVFVC1596 support?
XCVM1302-1LSEVFVC1596 has an operating temperature range of 0°C ~ 100°C (TJ).
What is XCVM1302-1LSEVFVC1596?
Are there related or alternative parts for XCVM1302-1LSEVFVC1596?
What package or case is XCVM1302-1LSEVFVC1596 available in?
Does XCVM1302-1LSEVFVC1596 have quantity-based pricing?
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