AMD_XCVM1402-2MLEVSVD1760
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AMD
XCVM1402-2MLEVSVD1760

777-XCVM1402-2MLEVSVD1760
IC VERSALPRIME ACAP FPGA 1760BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
600MHz, 1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
-
Number of I/O
726
Peripherals
DDR, DMA, PCIe
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XCVM1402-2MLEVSVD1760 Description

XCVM1402-2MLEVSVD1760 Description

The XCVM1402-2MLEVSVD1760 is a high-performance FPGA from AMD's Versal™ Prime series, designed to meet the demanding requirements of embedded systems. This IC features a dual-core architecture with a clock speed of 600MHz and 1.4GHz, providing robust processing capabilities. It operates within a temperature range of 0°C to 100°C (TJ), making it suitable for a wide range of industrial and commercial applications. The device is housed in a BGA package and is RoHS3 compliant, ensuring environmental sustainability and regulatory adherence.

XCVM1402-2MLEVSVD1760 Features

  • Dual-Core Architecture: Combines a 600MHz MPU with a 1.4GHz FPGA, offering versatile processing capabilities.
  • High I/O Count: Equipped with 726 I/O pins, providing extensive connectivity options.
  • Advanced Peripherals: Includes DDR, DMA, and PCIe for high-speed data transfer and communication.
  • Connectivity Options: Features CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, ensuring compatibility with various communication protocols.
  • Moisture Sensitivity Level (MSL): Rated at level 4 (72 hours), ensuring reliability in humid environments.
  • 1.2M Logic Cells: Provides significant flexibility and scalability for complex designs.
  • Active Product Status: Ensures long-term availability and support from AMD.

XCVM1402-2MLEVSVD1760 Applications

The XCVM1402-2MLEVSVD1760 is ideal for applications requiring high computational power and extensive connectivity. Its dual-core architecture and high I/O count make it suitable for:

  • Industrial Automation: For real-time control systems and data acquisition.
  • Telecommunications: In base stations and network infrastructure for high-speed data processing.
  • Automotive Systems: For advanced driver assistance systems (ADAS) and in-vehicle infotainment.
  • Medical Devices: In diagnostic equipment and imaging systems requiring precise control and data processing.
  • Aerospace and Defense: For mission-critical systems requiring high reliability and performance.

Conclusion of XCVM1402-2MLEVSVD1760

The XCVM1402-2MLEVSVD1760 is a versatile and powerful FPGA that stands out in its category due to its dual-core architecture, extensive connectivity options, and high I/O count. Its ability to operate within a wide temperature range and its RoHS3 compliance make it a reliable choice for various industries. The 1.2M logic cells offer significant flexibility for complex designs, ensuring that it can meet the evolving needs of modern embedded systems. Whether used in industrial automation, telecommunications, or automotive systems, the XCVM1402-2MLEVSVD1760 provides a robust solution for demanding applications.

FAQ

What is XCVM1402-2MLEVSVD1760?
XCVM1402-2MLEVSVD1760 is a System On Chip (SoC) from AMD. This product page provides its main specifications, pricing information, availability, and inquiry options.
What is the mounting type of XCVM1402-2MLEVSVD1760?
Are there related or alternative parts for XCVM1402-2MLEVSVD1760?
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