AMD_XCVM1502-1MLIVFVC1760
AMD_XCVM1502-1MLIVFVC1760
original

AMD
XCVM1502-1MLIVFVC1760

777-XCVM1502-1MLIVFVC1760
IC VERSALPRIME ACAP FPGA 1760BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
600MHz, 1.3GHz
Operating Temperature
-40°C ~ 110°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
500
Peripherals
DDR, DMA, PCIe
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XCVM1502-1MLIVFVC1760 Description

XCVM1502-1MLIVFVC1760 Description

The XCVM1502-1MLIVFVC1760 is a high-performance, versatile FPGA from AMD's Versal™ Prime series, designed to meet the demanding requirements of modern embedded systems. This IC features a dual-speed architecture capable of operating at 600MHz and 1.3GHz, providing exceptional processing capabilities and flexibility. The device integrates a powerful MPU and FPGA architecture, offering a robust platform for complex applications. With 256KB of onboard RAM, the XCVM1502-1MLIVFVC1760 ensures efficient data handling and processing. It also supports a substantial number of I/Os—500 in total—enabling extensive connectivity options. The device is equipped with essential peripherals such as DDR, DMA, and PCIe, further enhancing its functionality and integration capabilities. The product is currently active and is available in a tray package, ensuring reliable handling and storage. It is also ROHS3 compliant, adhering to stringent environmental standards. The XCVM1502-1MLIVFVC1760 features a moisture sensitivity level (MSL) of 4, allowing for a 72-hour exposure period before assembly.

XCVM1502-1MLIVFVC1760 Features

  • Dual-Speed Architecture: The XCVM1502-1MLIVFVC1760 operates at speeds of 600MHz and 1.3GHz, providing flexibility and high performance for various applications.
  • MPU and FPGA Integration: Combines the capabilities of a microprocessor unit (MPU) and a field-programmable gate array (FPGA) for versatile processing and programmability.
  • 256KB RAM: Equipped with 256KB of onboard RAM, ensuring efficient data handling and processing capabilities.
  • 500 I/Os: Supports a large number of I/Os, enabling extensive connectivity options for diverse applications.
  • Peripheral Support: Features essential peripherals such as DDR, DMA, and PCIe, enhancing functionality and integration capabilities.
  • Connectivity Options: Offers a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG.
  • Package and Compliance: Available in a tray package and is ROHS3 compliant, ensuring environmental sustainability and reliable handling.
  • Moisture Sensitivity Level: MSL 4 (72 Hours), allowing for flexibility in manufacturing processes.

XCVM1502-1MLIVFVC1760 Applications

The XCVM1502-1MLIVFVC1760 is ideal for a variety of applications due to its high performance, flexibility, and extensive connectivity options. Some specific use cases include:

  • Industrial Automation: The device's robust architecture and extensive I/O capabilities make it suitable for controlling complex industrial processes and systems.
  • Telecommunications: Its high-speed processing and connectivity options are ideal for applications in the telecommunications industry, such as base stations and network infrastructure.
  • Automotive Systems: The XCVM1502-1MLIVFVC1760 can be used in advanced driver-assistance systems (ADAS) and other automotive applications requiring high performance and reliability.
  • Medical Devices: The device's versatility and high performance make it suitable for medical imaging and diagnostic equipment.
  • Data Centers: The XCVM1502-1MLIVFVC1760 can be used in data center applications for tasks such as data processing and network management.

Conclusion of XCVM1502-1MLIVFVC1760

The XCVM1502-1MLIVFVC1760 is a powerful and versatile FPGA from AMD's Versal™ Prime series, offering high performance, extensive connectivity, and robust processing capabilities. Its dual-speed architecture, MPU and FPGA integration, and 256KB of onboard RAM make it an ideal solution for a wide range of applications, from industrial automation to telecommunications. The device's extensive I/O support and peripheral integration further enhance its functionality and integration capabilities. With its ROHS3 compliance and MSL 4 rating, the XCVM1502-1MLIVFVC1760 ensures environmental sustainability and reliability in manufacturing processes. Overall, the XCVM1502-1MLIVFVC1760 is a standout product in the embedded IC chips category, offering unique features and advantages over similar models.

FAQ

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The standard lead time for XCVM1502-1MLIVFVC1760 is 16 Weeks.
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