AMD_XCVM1802-1LLIVSVA2197
original

AMD
XCVM1802-1LLIVSVA2197

777-XCVM1802-1LLIVSVA2197
IC VERSAL AICORE FPGA 2197BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
400MHz, 1GHz
Operating Temperature
-40°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
770
Peripherals
DDR, DMA, PCIe
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XCVM1802-1LLIVSVA2197 Description

XCVM1802-1LLIVSVA2197 Description

The XCVM1802-1LLIVSVA2197 is a high-performance, versatile Field Programmable Gate Array (FPGA) from the Versal™ Prime series, manufactured by AMD. This IC is designed to meet the demands of complex embedded systems with its robust architecture and extensive connectivity options. It features a dual-core ARM Cortex-A53 Microprocessor Unit (MPU) and an FPGA fabric with 1.9M logic cells, offering a powerful combination of processing capabilities and programmable logic.

XCVM1802-1LLIVSVA2197 Features

High-Speed Processing and Logic Density:

  • Speed: The XCVM1802-1LLIVSVA2197 operates at speeds of up to 400MHz and 1GHz, ensuring rapid data processing and efficient execution of complex algorithms.
  • Architecture: It combines a MPU with an FPGA, providing the flexibility to handle both general-purpose processing and highly customized logic operations.
  • RAM Size: Equipped with 256KB of RAM, this FPGA can manage substantial data storage and processing tasks.
  • I/O Capability: With 770 I/O pins, it offers extensive connectivity options, making it suitable for applications requiring multiple interfaces and high data throughput.

Advanced Peripherals and Connectivity:

  • Peripherals: The XCVM1802-1LLIVSVA2197 supports DDR, DMA, and PCIe, enabling efficient data transfer and high-speed communication with external devices.
  • Connectivity: It includes a wide range of connectivity options such as CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating integration into various embedded systems.

Product Status and Compliance:

  • Product Status: Currently active, ensuring continued support and availability for ongoing projects.
  • RoHS Compliance: ROHS3 compliant, adhering to the latest environmental regulations and ensuring the product is suitable for use in environmentally conscious applications.
  • Moisture Sensitivity Level (MSL): MSL 4 (72 Hours), indicating its suitability for use in environments with varying humidity levels.

XCVM1802-1LLIVSVA2197 Applications

The XCVM1802-1LLIVSVA2197 is ideal for a variety of applications due to its high performance, flexibility, and extensive connectivity options. Some specific use cases include:

  • Telecommunications: Ideal for base stations and communication infrastructure, where high-speed data processing and low latency are critical.
  • Automotive: Suitable for advanced driver-assistance systems (ADAS) and in-vehicle infotainment systems, leveraging its robust processing capabilities and connectivity options.
  • Industrial Automation: Can be used in industrial control systems, where real-time processing and reliable communication with various peripherals are essential.
  • Data Centers: Effective for high-performance computing and data processing tasks, benefiting from its dual-core MPU and FPGA fabric.

Conclusion of XCVM1802-1LLIVSVA2197

The XCVM1802-1LLIVSVA2197 represents a significant advancement in the field of embedded systems, offering a powerful combination of processing power, programmable logic, and extensive connectivity options. Its dual-core MPU and FPGA architecture provide unparalleled flexibility, making it suitable for a wide range of applications from telecommunications to industrial automation. With its high-speed capabilities, robust peripherals, and compliance with environmental standards, the XCVM1802-1LLIVSVA2197 stands out as a versatile and reliable choice for modern embedded system designs.

FAQ

What is the mounting type of XCVM1802-1LLIVSVA2197?
XCVM1802-1LLIVSVA2197 uses a SMD/SMT mounting style based on the listed product specifications.
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