AMD

XCVM1802-1LSEVFVC1760

XCVM1802-1LSEVFVC1760 Description

The XCVM1802-1LSEVFVC1760 is a high-performance embedded IC chip from AMD's Versal™ Prime series, designed to deliver exceptional processing capabilities and flexibility. This FPGA integrates a powerful 1.9M logic cell architecture, supporting dual-speed operations at 400MHz and 1GHz. It is housed in a 1760 BGA package, ensuring robust mechanical and electrical performance. The operating temperature range of 0°C to 100°C (TJ) makes it suitable for a wide array of industrial and commercial applications. The XCVM1802-1LSEVFVC1760 is actively manufactured and RoHS3 compliant, adhering to stringent environmental standards.

XCVM1802-1LSEVFVC1760 Features

• Dual-Speed Performance: Capable of operating at 400MHz and 1GHz, the XCVM1802-1LSEVFVC1760 offers versatile speed options to optimize performance and power consumption based on application requirements.
• Robust Architecture: Combines MPU and FPGA functionalities, providing a flexible and scalable solution for complex embedded systems.
• Substantial RAM: Equipped with 256KB of RAM, ensuring efficient data handling and processing capabilities.
• Extensive I/O Options: With 500 I/O lines, this FPGA can interface with a wide variety of peripherals and systems, enhancing its versatility.
• Rich Peripheral Set: Includes DDR, DMA, PCIe, CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, facilitating seamless connectivity and communication.
• Moisture Sensitivity Level: MSL 4 (72 Hours) ensures the chip's reliability in various environmental conditions.
• Packaging: Supplied in a tray package, which is ideal for automated assembly processes and ensures the integrity of the components during handling and storage.

XCVM1802-1LSEVFVC1760 Applications

The XCVM1802-1LSEVFVC1760 is ideally suited for applications that demand high computational power, flexibility, and extensive connectivity options. Key application areas include:

• Industrial Automation: Its robust architecture and extensive I/O capabilities make it ideal for controlling complex machinery and systems in industrial environments.
• Telecommunications: The high-speed processing and advanced connectivity features are perfect for next-generation communication infrastructure, including 5G and beyond.
• Automotive Systems: The dual-speed operation and wide temperature range make it suitable for automotive applications, where reliability and performance are paramount.
• Data Centers: The integration of MPU and FPGA functionalities allows for efficient data processing and management in data center environments.
• Medical Devices: The high performance and reliability of the XCVM1802-1LSEVFVC1760 make it suitable for advanced medical imaging and diagnostic equipment.

Conclusion of XCVM1802-1LSEVFVC1760

The XCVM1802-1LSEVFVC1760 from AMD's Versal™ Prime series stands out as a versatile and high-performance FPGA, offering a unique blend of speed, flexibility, and connectivity. Its dual-speed operation, robust architecture, and extensive peripheral set provide significant advantages over similar models. Ideal for applications in industrial automation, telecommunications, automotive systems, data centers, and medical devices, the XCVM1802-1LSEVFVC1760 is a reliable choice for engineers and designers seeking to build advanced embedded systems.