AMD_XCVM1802-2LSEVSVA2197
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AMD
XCVM1802-2LSEVSVA2197

777-XCVM1802-2LSEVSVA2197
IC VERSAL AICORE FPGA 2197BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
450MHz, 1.08GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
770
Peripherals
DDR, DMA, PCIe
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XCVM1802-2LSEVSVA2197 Description

XCVM1802-2LSEVSVA2197 Description

The XCVM1802-2LSEVSVA2197 is a high-performance, embedded IC chip designed by AMD, belonging to the Versal™ Prime series. This FPGA (Field-Programmable Gate Array) is renowned for its versatile architecture, combining the capabilities of a multi-processing unit (MPU) with advanced FPGA functionalities. The XCVM1802-2LSEVSVA2197 features a robust set of technical specifications, making it suitable for a wide range of demanding applications in the embedded systems domain.

Key technical attributes of the XCVM1802-2LSEVSVA2197 include a dual-speed performance of 450MHz and 1.08GHz, ensuring high-speed processing capabilities. The operating temperature range of 0°C to 100°C (TJ) makes it suitable for both standard and rugged environments. The architecture integrates MPU and FPGA, offering a flexible and powerful platform for complex computing tasks. With 256KB of RAM, 770 I/Os, and a comprehensive set of peripherals including DDR, DMA, and PCIe, this FPGA is well-equipped to handle extensive data processing and communication tasks. The product is actively supported by AMD, ensuring ongoing development and compatibility with emerging technologies.

XCVM1802-2LSEVSVA2197 Features

The XCVM1802-2LSEVSVA2197 stands out with its unique features and performance benefits:

  • High-Speed Processing: With dual-speed capabilities of 450MHz and 1.08GHz, the XCVM1802-2LSEVSVA2197 delivers exceptional performance for demanding applications.
  • Versatile Architecture: The integration of MPU and FPGA functionalities provides a flexible platform that can be tailored to specific application needs.
  • Robust I/O and Connectivity: The FPGA supports 770 I/Os and a wide range of connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG, making it highly adaptable for various system integrations.
  • Advanced Peripherals: Equipped with DDR, DMA, and PCIe, the XCVM1802-2LSEVSVA2197 can handle high-bandwidth data transfers and complex memory operations.
  • Environmental Resilience: The operating temperature range of 0°C to 100°C (TJ) ensures reliable performance in diverse environmental conditions.
  • Compliance and Packaging: The XCVM1802-2LSEVSVA2197 is RoHS3 compliant and packaged in a tray, adhering to industry standards for environmental sustainability and ease of handling.
  • Moisture Sensitivity Level: With an MSL of 4 (72 Hours), the FPGA is designed to withstand moisture exposure during manufacturing processes.

XCVM1802-2LSEVSVA2197 Applications

The XCVM1802-2LSEVSVA2197 is ideal for a variety of applications due to its high performance and versatility:

  • Telecommunications: Ideal for 5G infrastructure, where high-speed data processing and low-latency communication are critical.
  • Data Centers: Suitable for edge computing and high-performance computing (HPC) applications, providing the necessary processing power and connectivity.
  • Industrial Automation: Perfect for industrial IoT (IIoT) systems, where robust I/O capabilities and environmental resilience are essential.
  • Automotive: Can be used in advanced driver-assistance systems (ADAS) and autonomous driving applications, requiring real-time data processing and high reliability.
  • Aerospace and Defense: Ideal for mission-critical applications that demand high performance, security, and environmental resilience.

Conclusion of XCVM1802-2LSEVSVA2197

The XCVM1802-2LSEVSVA2197 is a powerful and versatile FPGA that offers significant advantages over similar models in the market. Its dual-speed performance, versatile architecture, and extensive connectivity options make it a top choice for a wide range of demanding applications. Whether in telecommunications, data centers, industrial automation, automotive, or aerospace and defense, the XCVM1802-2LSEVSVA2197 provides reliable performance, adaptability, and future-proofing. AMD's active support and compliance with industry standards further enhance its value, making it a reliable choice for engineers and designers in the electronics industry.

FAQ

What package or case is XCVM1802-2LSEVSVA2197 available in?
XCVM1802-2LSEVSVA2197 is available in the 2197-BFBGA, FCBGA package / case.
What operating temperature range does XCVM1802-2LSEVSVA2197 support?
What is the mounting type of XCVM1802-2LSEVSVA2197?
What is XCVM1802-2LSEVSVA2197?
Is XCVM1802-2LSEVSVA2197 currently in stock?
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