AMD_XCVM1802-2MSEVFVC1760
original

AMD
XCVM1802-2MSEVFVC1760

777-XCVM1802-2MSEVFVC1760
IC VERSAL AICORE FPGA 1760BGA
16 Weeks

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Tech Specifications

Core Processor
Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™
Speed
600MHz, 1.4GHz
Operating Temperature
0°C ~ 100°C (TJ)
Architecture
MPU, FPGA
Flash Size
-
RAM Size
256KB
Number of I/O
500
Peripherals
DDR, DMA, PCIe
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XCVM1802-2MSEVFVC1760 Description

XCVM1802-2MSEVFVC1760 Description

The XCVM1802-2MSEVFVC1760 is a high-performance embedded IC chip from AMD's Versal™ Prime series, designed to meet the demanding requirements of modern embedded systems. This FPGA (Field-Programmable Gate Array) features a dual-core architecture, combining a 600MHz MPU (MicroProcessing Unit) with a 1.4GHz FPGA fabric, providing exceptional processing capabilities and flexibility. It is housed in a 1760 BGA (Ball Grid Array) package, ensuring robust mechanical stability and thermal performance.

XCVM1802-2MSEVFVC1760 Features

  • Dual-Core Architecture: The XCVM1802-2MSEVFVC1760 integrates a 600MHz MPU with a 1.4GHz FPGA fabric, offering a powerful combination of processing power and programmability. This dual-core setup allows for efficient handling of complex tasks, making it ideal for applications requiring both high-speed processing and customizable logic.
  • Memory and I/O: Equipped with 256KB of RAM and 500 I/O pins, the XCVM1802-2MSEVFVC1760 provides ample memory and connectivity options. The extensive I/O capabilities support a wide range of peripherals, including DDR, DMA, and PCIe, ensuring seamless integration with various external devices.
  • Peripherals and Connectivity: The FPGA supports a comprehensive set of peripherals and connectivity options, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, and USB OTG. This rich set of interfaces enables the XCVM1802-2MSEVFVC1760 to be used in a variety of applications, from industrial automation to advanced communication systems.
  • Operating Temperature: The XCVM1802-2MSEVFVC1760 is designed to operate within a temperature range of 0°C to 100°C (TJ), making it suitable for use in harsh environments where temperature fluctuations are common.
  • Moisture Sensitivity Level: With an MSL rating of 4 (72 Hours), the XCVM1802-2MSEVFVC1760 is well-suited for applications where moisture resistance is critical.
  • ROHS3 Compliance: The XCVM1802-2MSEVFVC1760 is ROHS3 compliant, ensuring it meets the highest environmental standards and is suitable for use in environmentally conscious designs.
  • Packaging: The device is available in a Tray package, facilitating easy handling and integration into manufacturing processes.

XCVM1802-2MSEVFVC1760 Applications

The XCVM1802-2MSEVFVC1760 is ideal for a wide range of applications due to its versatile architecture and extensive feature set. Some specific use cases include:

  • Industrial Automation: The combination of high-speed processing and robust I/O capabilities makes the XCVM1802-2MSEVFVC1760 well-suited for controlling complex industrial processes. Its ability to interface with various peripherals allows for seamless integration with existing industrial systems.
  • Advanced Communication Systems: The extensive connectivity options, including Ethernet and USB OTG, make the XCVM1802-2MSEVFVC1760 ideal for developing advanced communication systems. Its programmable logic fabric can be customized to meet specific communication protocol requirements.
  • Embedded Systems: The XCVM1802-2MSEVFVC1760's dual-core architecture and extensive memory make it a powerful choice for embedded systems that require both high-performance processing and customizable logic. Its ability to operate in a wide temperature range and its moisture resistance make it suitable for use in rugged environments.
  • Data Processing and Analytics: The FPGA fabric's programmability allows for efficient data processing and analytics tasks, making the XCVM1802-2MSEVFVC1760 suitable for applications where real-time data processing is critical.

Conclusion of XCVM1802-2MSEVFVC1760

The XCVM1802-2MSEVFVC1760 is a versatile and powerful embedded IC chip from AMD's Versal™ Prime series, offering a unique combination of high-speed processing and programmable logic. Its extensive feature set, including dual-core architecture, robust I/O capabilities, and comprehensive connectivity options, make it suitable for a wide range of applications. The XCVM1802-2MSEVFVC1760's ability to operate in harsh environments and its compliance with environmental standards further enhance its appeal. Whether used in industrial automation, advanced communication systems, or embedded systems, the XCVM1802-2MSEVFVC1760 provides a reliable and efficient solution for modern electronics design.

FAQ

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